Abstract:
In a paper feed system where a first paper feed mechanism takes out and transfers one by one a plurality of papers placed on a paper feed table in a stack and a second paper feed mechanism transfers the papers transferred by the first paper feed mechanism to an image forming section at a predetermined timing. A paper edge detector is provided between the first and second paper feed mechanisms to detect an edge of the paper, and the first paper feed mechanism is controlled to transfer the papers at a first speed and then at a second speed not higher than the first speed when the paper edge detector detects the leading edge of the paper, the second speed being determined on the basis of the timing at which the leading edge of the paper is detected.
Abstract:
Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.
Abstract:
There is provided a toner which is excellent in temporal stability and environmental stability of charges and which is capable of forming images that contains almost no background fog and has high density even in a long-term use and in use at a high-temperature and high-humid circumstance, and furthermore the toner which is not scattered inside an image forming apparatus and thus causes no contamination inside the apparatus, and there is further provided a method of manufacturing the above toner. An organic boron compound is contained as a charge control agent, a surface CCA concentration per specific surface area of toner falls in a range from 2.1×10−6 g/cm2 to 5.5×10−6 g/cm2, and a surface CCA concentration is 1.8×10−3 g/g or more.
Abstract translation:提供了一种调色剂,其电荷的时间稳定性和环境稳定性优异,并且能够形成几乎不含背景雾的图像,并且即使在长期使用中并且在高温高度下使用也具有高密度 并且此外,不会在图像形成装置内散射的调色剂,因此不会在设备内部产生污染,并且还提供了制造上述调色剂的方法。 作为电荷控制剂含有有机硼化合物,调色剂比表面积的表面CCA浓度在2.1×10 -6 g / cm 2〜5.5×10 -6 g / cm 2的范围内,表面CCA浓度 为1.8×10 -3 g / g以上。
Abstract:
Ethylene-based resin, which exhibits a satisfactorily high melt tension and can provide a molded object excellent in mechanical strength, the ethylene-based resin characterized in simultaneously satisfying the requirements [1] to [5] described below: [1] melt flow rate (MFR) under a loading of 2.16 kg at 190° C. is in the range of 0.1 to 100 g/10 minutes; [2] density (d) is in the range of 875 to 970 kg/m3; [3] ratio [MT/η*(g/P)] of melt tension [MT(g)] at 190° C. to shearing viscosity [η*(P)] at 200° C. at an angular velocity of 1.0 rad/sec. is in the range of 1.50×10−4 to 9.00×10−4; [4] sum [(A+B)(/1000C)] of the number of methyl branches [A(/1000C)] and the number of ethyl branches [B(/1000C)] per 1000 carbon atoms measured by 13C-NMR is 1.8 or less; and [5] zero shear viscosity [η0(P)] at 200° C. and weight-average molecular weight (Mw) measured by GPC-viscosity detector method (GPC-VISCO) satisfy the following relational expression (Eq-1): 0.01×10−13×Mw3.4≦η0≦4.5×10−13×Mw3.4 (Eq-1).
Abstract:
In a sound insulating device, a long sound insulating member including a polyhedron body bent at a predetermined angle to open a sound source side is sequentially stacked between supporting columns arranged in an upstanding manner at a predetermined spacing to configure a sound insulating wall 10 having an appropriate height. Sound waves from a sound source interfere with each other due to the polyhedron body to reduce noise.
Abstract:
The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the fillers followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.
Abstract:
A toner is a capsule particle including a toner particle composed of a core particle that is a resin particle and shell particles covering the surface of the core particle. The toner is manufactured by controlling the particle size so that the toner particles have a volume average particle size of 4.0 or more and 8.0 μm or less, and a ratio of a toner particle having a number average particle size of 3.0 μm or less of 8% by number or more and 25% by number or less to the entirety of the toner particles. The shell particles are melt-bonded to the core particle to be integrated therewith.
Abstract:
The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.
Abstract:
There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.