发明申请
- 专利标题: Budgeting Electromigration-Related Reliability Among Metal Paths In The Design Of A Circuit
- 专利标题(中): 电路设计中金属路径的电子迁移相关可靠性预算
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申请号: US12355796申请日: 2009-01-18
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公开(公告)号: US20090187869A1公开(公告)日: 2009-07-23
- 发明人: Palkesh Jain , Young-Joon Park , Srikanth Krishnan , Guruprasad C
- 申请人: Palkesh Jain , Young-Joon Park , Srikanth Krishnan , Guruprasad C
- 申请人地址: US TX Dallas
- 专利权人: TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人: TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址: US TX Dallas
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
Apportioning unequally contributions of different metal paths of a circuit to electromigration (EM) reliability. In an embodiment, a corresponding parameter value representing a magnitude of excess current flowing in a single direction in each metal path is determined. A desired reliability measure for electromigration (EM) is apportioned among the metal paths based on computed parameter values for the corresponding metal path. A reliability analysis for the circuit is performed based on the apportioning. In an embodiment, metal paths which predominantly carry currents with an average value less than a threshold are excluded from being considered as contributors to EM degradation.
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