Invention Application
- Patent Title: Budgeting Electromigration-Related Reliability Among Metal Paths In The Design Of A Circuit
- Patent Title (中): 电路设计中金属路径的电子迁移相关可靠性预算
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Application No.: US12355796Application Date: 2009-01-18
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Publication No.: US20090187869A1Publication Date: 2009-07-23
- Inventor: Palkesh Jain , Young-Joon Park , Srikanth Krishnan , Guruprasad C
- Applicant: Palkesh Jain , Young-Joon Park , Srikanth Krishnan , Guruprasad C
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Apportioning unequally contributions of different metal paths of a circuit to electromigration (EM) reliability. In an embodiment, a corresponding parameter value representing a magnitude of excess current flowing in a single direction in each metal path is determined. A desired reliability measure for electromigration (EM) is apportioned among the metal paths based on computed parameter values for the corresponding metal path. A reliability analysis for the circuit is performed based on the apportioning. In an embodiment, metal paths which predominantly carry currents with an average value less than a threshold are excluded from being considered as contributors to EM degradation.
Public/Granted literature
- US08219953B2 Budgeting electromigration-related reliability among metal paths in the design of a circuit Public/Granted day:2012-07-10
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