Budgeting Electromigration-Related Reliability Among Metal Paths In The Design Of A Circuit
    1.
    发明申请
    Budgeting Electromigration-Related Reliability Among Metal Paths In The Design Of A Circuit 有权
    电路设计中金属路径的电子迁移相关可靠性预算

    公开(公告)号:US20090187869A1

    公开(公告)日:2009-07-23

    申请号:US12355796

    申请日:2009-01-18

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5036

    摘要: Apportioning unequally contributions of different metal paths of a circuit to electromigration (EM) reliability. In an embodiment, a corresponding parameter value representing a magnitude of excess current flowing in a single direction in each metal path is determined. A desired reliability measure for electromigration (EM) is apportioned among the metal paths based on computed parameter values for the corresponding metal path. A reliability analysis for the circuit is performed based on the apportioning. In an embodiment, metal paths which predominantly carry currents with an average value less than a threshold are excluded from being considered as contributors to EM degradation.

    摘要翻译: 分配电路的不同金属路径对电迁移(EM)可靠性的不平等贡献。 在一个实施例中,确定表示在每个金属路径中沿单个方向流动的过量电流的大小的相应参数值。 基于用于相应金属路径的计算参数值,在金属路径中分配用于电迁移(EM)的期望的可靠性度量。 基于分配进行电路的可靠性分析。 在一个实施例中,主要承载具有小于阈值的平均值的电流的金属路径被排除为被认为是EM降解的贡献者。