Invention Application
US20090189190A1 High Electron Mobility Transistor, Field-Effect Transistor, Epitaxial Substrate, Method of Manufacturing Epitaxial Substrate, and Method of Manufacturing Group III Nitride Transistor
有权
高电子迁移率晶体管,场效应晶体管,外延基板,制造外延基板的方法和制造III族氮化物晶体管的方法
- Patent Title: High Electron Mobility Transistor, Field-Effect Transistor, Epitaxial Substrate, Method of Manufacturing Epitaxial Substrate, and Method of Manufacturing Group III Nitride Transistor
- Patent Title (中): 高电子迁移率晶体管,场效应晶体管,外延基板,制造外延基板的方法和制造III族氮化物晶体管的方法
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Application No.: US11571156Application Date: 2006-03-03
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Publication No.: US20090189190A1Publication Date: 2009-07-30
- Inventor: Shin Hashimoto , Makoto Kiyama , Takashi Sakurada , Tatsuya Tanabe , Kouhei Miura , Tomihito Miyazaki
- Applicant: Shin Hashimoto , Makoto Kiyama , Takashi Sakurada , Tatsuya Tanabe , Kouhei Miura , Tomihito Miyazaki
- Applicant Address: JP Osaka-shi
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka-shi
- Priority: JP2005-154406 20050526
- International Application: PCT/JP2006/304043 WO 20060303
- Main IPC: H01L29/80
- IPC: H01L29/80 ; H01L21/20

Abstract:
Affords high electron mobility transistors having a high-purity channel layer and a high-resistance buffer layer. A high electron mobility transistor 11 is provided with a supporting substrate 13 composed of gallium nitride, a buffer layer 15 composed of a first gallium nitride semiconductor, a channel layer 17 composed of a second gallium nitride semiconductor, a semiconductor layer 19 composed of a third gallium nitride semiconductor, and electrode structures (a gate electrode 21, a source electrode 23 and a drain electrode 25) for the transistor 11. The band gap of the third gallium nitride semiconductor is broader than that of the second gallium nitride semiconductor. The carbon concentration NC1 of the first gallium nitride semiconductor is 4×1017 cm−3 or more. The carbon concentration NC2 of the second gallium nitride semiconductor is less than 4×1016 cm−3.
Public/Granted literature
- US07749828B2 Method of manufacturing group III Nitride Transistor Public/Granted day:2010-07-06
Information query
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