发明申请
- 专利标题： SYSTEM FOR HANDLING SEMICONDUCTOR DIES
- 专利标题（中）： 用于处理半导体器件的系统
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申请号： US12022308申请日： 2008-01-30
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公开(公告)号： US20090191029A1公开(公告)日： 2009-07-30
- 发明人: Taeg Ki Lim , Jason Lee , Gab Yong Min , Jung Ho Kim
- 申请人： Taeg Ki Lim , Jason Lee , Gab Yong Min , Jung Ho Kim
- 主分类号： H01L21/677
- IPC分类号： H01L21/677
摘要：
The present invention provides a system for handling semiconductor dies, comprising providing a semiconductor die adhered to a tacky tape, cooling the semiconductor die and the tacky tape to reduce the adhesion between the semiconductor die and the tacky tape, separating the semiconductor die from the tacky tape, and moving the semiconductor die.
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IPC分类:
