公开(公告)号：US20090191029A1

公开(公告)日：2009-07-30

申请号：US12022308

申请日：2008-01-30

申请人： Taeg Ki Lim ,  Jason Lee ,  Gab Yong Min ,  Jung Ho Kim

发明人： Taeg Ki Lim ,  Jason Lee ,  Gab Yong Min ,  Jung Ho Kim

IPC分类号： H01L21/677

CPC分类号： H01L21/67132

摘要： The present invention provides a system for handling semiconductor dies, comprising providing a semiconductor die adhered to a tacky tape, cooling the semiconductor die and the tacky tape to reduce the adhesion between the semiconductor die and the tacky tape, separating the semiconductor die from the tacky tape, and moving the semiconductor die.

摘要翻译： 本发明提供了一种用于处理半导体管芯的系统，包括提供粘附到粘性带上的半导体管芯，冷却半导体管芯和粘性带以减小半导体管芯和粘性带之间的粘合，将半导体管芯与粘性分离 胶带，并移动半导体芯片。

公开(公告)号：US08221583B2

公开(公告)日：2012-07-17

申请号：US12018065

申请日：2008-01-22

申请人： Gab Yong Min ,  Dong Hyong Lee ,  Jung Ho Kim ,  SeungYun Ahn

发明人： Gab Yong Min ,  Dong Hyong Lee ,  Jung Ho Kim ,  SeungYun Ahn

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/67011 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

摘要： A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.

摘要翻译： 一种用于从胶带剥离半导体芯片的半导体系统，包括：提供在其顶部上具有孔的外壳; 提供具有针底延伸部的磁体; 提供磁性地保持在磁体上的针; 通过所述孔施加真空以将粘合剂材料保持在所述外壳体上; 并且将针穿过外壳中的孔延伸。

公开(公告)号：US20080173407A1

公开(公告)日：2008-07-24

申请号：US12018065

申请日：2008-01-22

申请人： Gab Yong Min ,  Dong Hyong Lee ,  Jung Ho Kim ,  SeungYun Ahn

发明人： Gab Yong Min ,  Dong Hyong Lee ,  Jung Ho Kim ,  SeungYun Ahn

IPC分类号： B32B43/00

CPC分类号： H01L21/67132 ,  H01L21/67011 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

摘要： A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.

摘要翻译： 一种用于从胶带剥离半导体芯片的半导体系统，包括：提供在其顶部上具有孔的外壳; 提供具有针底延伸部的磁体; 提供磁性地保持在磁体上的针; 通过所述孔施加真空以将粘合剂材料保持在所述外壳体上; 并且将针穿过外壳中的孔延伸。

公开(公告)号：US10276589B2

公开(公告)日：2019-04-30

申请号：US15499291

申请日：2017-04-27

申请人： Hyung Joon Kim ,  Yong Seok Cho ,  BiO Kim ,  Jung Ho Kim ,  Joong Yun Ra ,  Sung Hae Lee

发明人： Hyung Joon Kim ,  Yong Seok Cho ,  BiO Kim ,  Jung Ho Kim ,  Joong Yun Ra ,  Sung Hae Lee

IPC分类号： H01L27/11582 ,  H01L21/02 ,  H01L21/28 ,  H01L21/311 ,  H01L29/51 ,  H01L27/11565

摘要： A method of manufacturing a semiconductor device includes forming a mold structure including alternately stacked mold insulating and sacrificial layers on a substrate, forming a vertical structure through the mold structure, forming side openings by removing the sacrificial, forming a preliminary dielectric layer in the side openings, forming a dielectric layer by heat-treating the preliminary dielectric layer, removing a surface layer of the dielectric layer, forming a first conductive layer covering the dielectric layer in the side openings, and forming a second conductive layer covering the first conductive layer and filling the side openings.

公开(公告)号：US08445343B2

公开(公告)日：2013-05-21

申请号：US13030729

申请日：2011-02-18

申请人： Jung Ho Kim ,  Kihyun Hwang ,  Sangryol Yang ,  Yong-Hoon Sang ,  Ju-Eun Kim

发明人： Jung Ho Kim ,  Kihyun Hwang ,  Sangryol Yang ,  Yong-Hoon Sang ,  Ju-Eun Kim

IPC分类号： H01L21/8242 ,  H01L21/8244

CPC分类号： H01L29/66833 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/7926

摘要： Methods of fabricating a semiconductor device include alternatingly and repeatedly stacking sacrificial layers and first insulating layers on a substrate, forming an opening penetrating the sacrificial layers and the first insulating layers, and forming a spacer on a sidewall of the opening, wherein a bottom surface of the opening is free of the spacer. A semiconductor layer is formed in the opening. Related devices are also disclosed.

摘要翻译： 制造半导体器件的方法包括在衬底上交替地且重复地堆叠牺牲层和第一绝缘层，形成贯穿牺牲层和第一绝缘层的开口，以及在开口的侧壁上形成间隔物，其中， 开口没有间隔件。 在开口中形成半导体层。 还公开了相关设备。

公开(公告)号：US20110049732A1

公开(公告)日：2011-03-03

申请号：US12805679

申请日：2010-08-12

申请人： Jung Ho Kim

发明人： Jung Ho Kim

IPC分类号： B01F3/04 ,  F24F3/14 ,  F28F3/08

CPC分类号： F24F6/06

摘要： Disclosed herein are a humidification apparatus having a disc assembly, and a disc assembly thereof. The disc assembly includes at least one disc member assembled by stacking, a first clamp disposed at one side of the at least one disc member, and a second clamp disposed at the other side of the at least one disc member. Each of the at least one disc member includes at least one recess part indented on the edge thereof, and the first clamp includes at least one recess connection part inserted into the at least one recess part so as to prevent movement of the at least one disc member.

摘要翻译： 这里公开了一种具有盘组件的加湿装置及其盘组件。 盘组件包括至少一个通过堆叠组装的盘构件，设置在至少一个盘构件的一侧的第一夹具和设置在至少一个盘构件的另一侧的第二夹具。 所述至少一个盘构件中的每一个包括在其边缘上缩进的至少一个凹部，并且所述第一夹具包括插入所述至少一个凹部中的至少一个凹部连接部，以防止所述至少一个盘 会员。

公开(公告)号：US20090290188A1

公开(公告)日：2009-11-26

申请号：US12153494

申请日：2008-05-20

申请人： Jung Ho Kim

发明人： Jung Ho Kim

IPC分类号： G06F3/12

CPC分类号： G06F3/1287 ,  G06F3/1204 ,  G06F3/1205 ,  G06F3/1254 ,  G06F3/1272 ,  G06T11/60

摘要： Disclosed herein is a reception method for an online print ordering system. In the reception method, the case in which a single image file includes various types of print entities is determined to be normal and then composition files are enabled to be created for the respective entities, thereby improving the efficiency of the print ordering system and customers' convenience of use.

摘要翻译： 这里公开了一种在线打印排序系统的接收方法。 在接收方法中，单个图像文件包括各种类型的打印实体的情况被确定为正常，然后可以为各个实体创建合成文件，从而提高打印订购系统和客户的打印订单系统的效率， 使用方便。

公开(公告)号：US20080130664A1

公开(公告)日：2008-06-05

申请号：US11790559

申请日：2007-04-26

申请人： Ji Hoon Lee ,  Jung Ho Kim

发明人： Ji Hoon Lee ,  Jung Ho Kim

IPC分类号： H04L12/28

CPC分类号： H04W40/28 ,  H04L45/00 ,  H04L45/122 ,  H04L45/24

摘要： A method of establishing a multipath in a heterogeneous interface environment among wireless nodes including a source node, a relay node, and a destination node which receives a message from the source node via the relay node, the method including: receiving a route request message by a wireless node; and associating at least two heterogeneous interfaces of the wireless node by using a destination node address in the route request message.

摘要翻译： 一种在包括源节点，中继节点和目的地节点的无线节点之间的异构接口环境中建立多路径的方法，所述源节点，中继节点和目的地节点经由所述中继节点从所述源节点接收消息，所述方法包括：接收路由请求消息， 无线节点; 以及通过使用所述路由请求消息中的目的地节点地址来关联所述无线节点的至少两个异构接口。

公开(公告)号：US20080064327A1

公开(公告)日：2008-03-13

申请号：US11708457

申请日：2007-02-21

申请人： Young Gon Choi ,  Hyun Cheol Park ,  Eung Sun Kim ,  Jin Sae Jung ,  Jung Ho Kim ,  Kyle Kim ,  Ji Hoon Lee ,  Sung Won Lee ,  Yong Sung Roh ,  Hae Lyong Kim

发明人： Young Gon Choi ,  Hyun Cheol Park ,  Eung Sun Kim ,  Jin Sae Jung ,  Jung Ho Kim ,  Kyle Kim ,  Ji Hoon Lee ,  Sung Won Lee ,  Yong Sung Roh ,  Hae Lyong Kim

IPC分类号： H04B3/36

CPC分类号： H04L1/06 ,  H04B7/15592 ,  H04L2001/0097

摘要： Provided is a constellation rotation relay system and constellation rotation relay method which can acquire full diversity gain by performing constellation rotation for a channel matrix in a relay network when configuring a virtual MIMO channel. The constellation rotation system includes a matrix creator for creating a symbol matrix by configuring a symbol transmitted in parallel from a source of a relay network; and a constellation rotation unit constellation rotating the symbol in the symbol matrix by adding a constellation rotation matrix to the created symbol matrix.

摘要翻译： 提供了一种星座旋转中继系统和星座旋转中继方法，其可以在配置虚拟MIMO信道时通过对中继网络中的信道矩阵执行星座旋转来获取全分集增益。 星座旋转系统包括矩阵创建器，用于通过配置从中继网络的源并行发送的符号来创建符号矩阵; 以及星座旋转单元星座，通过将星座旋转矩阵添加到所创建的符号矩阵来旋转符号矩阵中的符号。

公开(公告)号：US07253024B2

公开(公告)日：2007-08-07

申请号：US10514436

申请日：2003-02-13

申请人： Hong Jun Yu ,  Jung Ho Kim

发明人： Hong Jun Yu ,  Jung Ho Kim

IPC分类号： H01L21/50 ,  H01L23/34 ,  H01L23/02 ,  H01L21/48 ,  H01L21/44

CPC分类号： G06K19/07722 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599

摘要： The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.

摘要翻译： 本发明提供一种通过层压多个箔来制造IC卡的方法。 本发明的方法包括将COB，COB的接触电极面向下的步骤; 铺设至少2个具有孔的箔，其中所述COB插入箔的相应孔中; 在具有孔的箔上铺设不具有孔的箔; 并压缩所有的箔片。