发明申请
- 专利标题: SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION METHOD, AND SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体封装环氧树脂组合物,制备方法和半导体器件
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申请号: US12357764申请日: 2009-01-22
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公开(公告)号: US20090192258A1公开(公告)日: 2009-07-30
- 发明人: Tomoyoshi Tada , Shoichi Osada , Miyuki Wakao , Kazutoshi Tomiyoshi , Kenichi Totsuka , Tadaharu Ikeda
- 申请人: Tomoyoshi Tada , Shoichi Osada , Miyuki Wakao , Kazutoshi Tomiyoshi , Kenichi Totsuka , Tadaharu Ikeda
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-014502 20080125
- 主分类号: C08L63/00
- IPC分类号: C08L63/00
摘要:
A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 μm, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.