发明申请
- 专利标题： Multi-chip package semiconductor device and method of detecting a failure thereof
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申请号： US12385945申请日： 2009-04-24
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公开(公告)号： US20090212812A1公开(公告)日： 2009-08-27
- 发明人: Sang-Jib Han
- 申请人： Sang-Jib Han
- 优先权： KR10-2005-0109443 20051116
- 主分类号： G01R31/26
- IPC分类号： G01R31/26
摘要：
A semiconductor chip may include at least one power supply pad for receiving an external power voltage, at least one input/output pad, an internal function block that may be configured to operate based on a power voltage to at least one of receive and transmit a signal through the input/output pad, and a mode set circuit that may enable or disable the power voltage by a mode set signal in an individual chip test mode.
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