Manufacturing an electronic component 5 in which an interposer 50 is bonded to a base circuit sheet includes a base circuit forming step for forming a base-side terminal in a continuous base member 610 in continuous sheet form, an arranging/bonding step for arranging the interposer 50 on a surface of the continuous base member 610 in which the base-side terminal is formed and bonding the interposer 50, and a separating step for cutting out the electronic component 5 from the continuous base member 610 to which the interposer 50 is bonded. In this electronic component manufacturing method, for the common continuous base member 610, each of the steps is repeated in parallel while this continuous base material 610 is being advanced.