The present invention provides a mounting structure for a surface mounted device capable of reducing sufficiently the stress applied to external joint terminal portions of a surface mounted device due to an impact caused by, for example, dropping a mobile device such as a mobile phone. A mounting structure for a surface mounted device includes: a printed circuit board; a BGA package as a surface mounted device mounted on the printed circuit board; a reinforcing member attached to the printed circuit board astride the BGA package for covering the BGA package; and a pressure pin as a pressure member passing through a top plate of the reinforcing member, being in contact with the top surface of the BGA package, and being fixed to the reinforcing member with solder.