发明申请
- 专利标题： LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- 专利标题（中）： 发光二极管封装结构及其制造方法
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申请号： US12126935申请日： 2008-05-26
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公开(公告)号： US20090230417A1公开(公告)日： 2009-09-17
- 发明人: Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
- 申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
- 申请人地址： TW Hsinchu
- 专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址： TW Hsinchu
- 优先权： CN200810083769.9 20080312
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/02
摘要：
The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
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