发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- 专利标题(中): 半导体器件及其制造方法
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申请号: US12395008申请日: 2009-02-27
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公开(公告)号: US20090230541A1公开(公告)日: 2009-09-17
- 发明人: Makoto Araki , Shimpei Ishida , Shigeru Nakamura
- 申请人: Makoto Araki , Shimpei Ishida , Shigeru Nakamura
- 专利权人: RENESAS TECHNOLOGY CORP.
- 当前专利权人: RENESAS TECHNOLOGY CORP.
- 优先权: JP2008-064322 20080313
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/78 ; H01L21/50
摘要:
A semiconductor device in which a chip is embedded in a wiring board and bump electrodes formed over the front surface of the semiconductor chip are flip-chip coupled to wiring formed in the wiring board and the entire back surface of the semiconductor chip functions well as a back electrode and a method of manufacturing the semiconductor device. A semiconductor chip is embedded inside a wiring board. The semiconductor chip is flip-chip coupled (face down) to a base substrate as the core layer of the wiring board through bump electrodes. A conductive film is formed over the semiconductor chip's surface reverse to the surface over which bump electrodes are formed. The conductive film functions as a back electrode which supplies a reference voltage to the integrated circuit in the semiconductor chip. The conductive film is electrically coupled to third-layer wiring through vias.