Invention Application
- Patent Title: Buried pattern substrate
- Patent Title (中): 埋地图案衬底
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Application No.: US12457166Application Date: 2009-06-02
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Publication No.: US20090242238A1Publication Date: 2009-10-01
- Inventor: Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
- Applicant: Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0063637 20060706
- Main IPC: H05K1/09
- IPC: H05K1/09
Abstract:
A buried pattern substrate includes an insulation layer; a circuit pattern buried in the insulation layer such that a part thereof is exposed at a surface of the insulation layer; and a stud bump buried in the insulation layer such that one end portion is exposed at one surface of the insulation layer, and such that the other end portion is exposed at the other surface of the insulation layer.
Information query
