发明申请
- 专利标题： Mounting device for a chip component
- 专利标题（中）： 芯片组件的安装装置
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申请号： US12379165申请日： 2009-02-13
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公开(公告)号： US20090254213A1公开(公告)日： 2009-10-08
- 发明人: Takaaki Domon , Toshiyuki Nagatsuka , Toyotaka Kobayashi , Yushi Ogasawara
- 申请人： Takaaki Domon , Toshiyuki Nagatsuka , Toyotaka Kobayashi , Yushi Ogasawara
- 申请人地址： JP TOKYO
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP TOKYO
- 优先权： JP2008-087770 20080328
- 主分类号： H01L21/67
- IPC分类号： H01L21/67
摘要：
The present invention provides a mounting device for a chip component, allowing short operating time for mounting a chip component after cutting, and capable of reliably mounting only an undamaged, non-defective chip component. The mounting device comprises carriers 10, 16 and 24, which transport a chip component 6a, peeled from a holding sheet 4 for holding cut individual chip components 6a, to a mounting substrate 20, and mount the chip component 6a thereon. The carriers 16 and 24 are provided with measuring terminals 18 and 26 for measuring electric properties of the chip component 6a during transporting. A control circuit is provided with the mounting device for controlling the carriers 16 and 24 so as to mount the chip component 6a on the mounting substrate 20 only when a measurement of the chip component 6a determined through measuring terminals 18 and 26 satisfies mountable conditions.