公开(公告)号：US20090254213A1

公开(公告)日：2009-10-08

申请号：US12379165

申请日：2009-02-13

申请人： Takaaki Domon ,  Toshiyuki Nagatsuka ,  Toyotaka Kobayashi ,  Yushi Ogasawara

发明人： Takaaki Domon ,  Toshiyuki Nagatsuka ,  Toyotaka Kobayashi ,  Yushi Ogasawara

IPC分类号： H01L21/67

CPC分类号： H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L22/14 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/16 ,  H01L2224/78743 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00

摘要： The present invention provides a mounting device for a chip component, allowing short operating time for mounting a chip component after cutting, and capable of reliably mounting only an undamaged, non-defective chip component. The mounting device comprises carriers 10, 16 and 24, which transport a chip component 6a, peeled from a holding sheet 4 for holding cut individual chip components 6a, to a mounting substrate 20, and mount the chip component 6a thereon. The carriers 16 and 24 are provided with measuring terminals 18 and 26 for measuring electric properties of the chip component 6a during transporting. A control circuit is provided with the mounting device for controlling the carriers 16 and 24 so as to mount the chip component 6a on the mounting substrate 20 only when a measurement of the chip component 6a determined through measuring terminals 18 and 26 satisfies mountable conditions.

摘要翻译： 本发明提供了一种用于芯片部件的安装装置，其能够在切割后安装芯片部件的操作时间短，并且能够可靠地仅安装未损坏的无缺陷的芯片部件。 安装装置包括载体10,16和24，其将从用于保持切割的单个芯片部件6a的保持片4剥离的芯片部件6a传送到安装基板20，并且在其上安装芯片部件6a。 载体16和24设置有测量端子18和26，用于测量传输期间芯片部件6a的电特性。 控制电路设置有用于控制载体16和24的安装装置，以便仅当通过测量端子18和26确定的芯片部件6a的测量满足可安装条件时才将芯片部件6a安装在安装基板20上。