发明申请
- 专利标题： METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT, AS WELL AS A SEMICONDUCTOR COMPONENT, IN A PARTICULAR A DIAPHRAGM SENSOR
- 专利标题（中）： 制造半导体元件的方法，作为半导体元件，特别是膜片式传感器
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申请号： US12490762申请日： 2009-06-24
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公开(公告)号： US20090256219A1公开(公告)日： 2009-10-15
- 发明人: Hubert BENZEL , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
- 申请人： Hubert BENZEL , Frank Schaefer , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Joerg Brasas
- 优先权： DE10358859.0 20031216; DE102004036035.9 20040724
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces.
公开/授权文献
- US07755152B2 Semiconductor component configured as a diaphragm sensor 公开/授权日：2010-07-13
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