公开(公告)号：US08901684B2

公开(公告)日：2014-12-02

申请号：US13489124

申请日：2012-06-05

申请人： Hubert Benzel ,  Frank Henning ,  Armin Scharping ,  Christoph Schelling

发明人： Hubert Benzel ,  Frank Henning ,  Armin Scharping ,  Christoph Schelling

IPC分类号： G01L9/00 ,  B81C3/00

CPC分类号： B81C3/001 ,  B81B2201/0264 ,  B81C2201/019 ,  G01L9/0055

摘要： A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.

摘要翻译： 一种微机械部件，包括多个半导体芯片的第一复合材料，所述第一复合材料具有第一正面和背面，相应的多个载体基板的第二复合材料，所述第二复合材料具有第二前表面和后表面; 其中所述第一前表面和所述第二前表面经由结构化粘合促进剂层连接，使得每个半导体芯片基本上不含空腔连接到对应于相应的微机械部件的对应的载体基板。

公开(公告)号：US08749013B2

公开(公告)日：2014-06-10

申请号：US12302677

申请日：2007-04-23

申请人： Hubert Benzel ,  Simon Armbruster ,  Arnim Hoechst ,  Christoph Schelling ,  Ando Feyh

发明人： Hubert Benzel ,  Simon Armbruster ,  Arnim Hoechst ,  Christoph Schelling ,  Ando Feyh

IPC分类号： H01L31/058

CPC分类号： B81B3/0081 ,  B81B2201/0278 ,  B81B2203/0109 ,  B81B2207/015 ,  B81C2201/0109 ,  G01J5/06 ,  G01J5/20

摘要： A sensor, in particular for the spatially resolved detection, includes a substrate, at least one micropatterned sensor element having an electric characteristic whose value varies as a function of the temperature, and at least one diaphragm above a cavity, the sensor element being disposed on the underside of the at least one diaphragm, and the sensor element being contacted via connecting lines, which extend within, on top of or underneath the diaphragm. In particular, a plurality of sensor elements may be formed as diode pixels within a monocrystalline layer formed by epitaxy. Suspension springs, which accommodate the individual sensor elements in elastic and insulating fashion, may be formed within the diaphragm.

摘要翻译： 特别是用于空间分辨检测的传感器包括基板，至少一个微图案化的传感器元件，其具有值随温度变化的电特性，以及在空腔上方的至少一个隔膜，传感器元件设置在 所述至少一个隔膜的下侧，并且所述传感器元件经由连接线接触，所述连接线在隔膜的顶部或下方延伸。 特别地，多个传感器元件可以形成为通过外延形成的单晶层内的二极管像素。 可以在隔膜内形成以弹性和绝缘方式容纳各个传感器元件的悬挂弹簧。

公开(公告)号：US20140097511A1

公开(公告)日：2014-04-10

申请号：US14049672

申请日：2013-10-09

申请人： Gregor Schuermann ,  Hubert Benzel

发明人： Gregor Schuermann ,  Hubert Benzel

IPC分类号： H01L27/08 ,  H01L29/66

CPC分类号： H01L27/0814 ,  G01J5/00 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/0853 ,  H01L21/00 ,  H01L21/76229 ,  H01L21/76289 ,  H01L25/00 ,  H01L27/14 ,  H01L27/14649 ,  H01L29/66136 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated diode array and a corresponding manufacturing method are provided. The integrated diode array includes a substrate having an upper side, and a plurality of blocks of several diodes, which are positioned in a planar manner and are suspended at the substrate above a cavity situated below them in the substrate. The blocks are separated from one another by respective gaps, and within a specific block, the individual diodes are electrically insulated from one another by first STI trenches situated between them.

摘要翻译： 提供了一种集成二极管阵列和相应的制造方法。 集成二极管阵列包括具有上侧的衬底和多个二极管的块，其以平面方式定位并且悬挂在位于衬底之下的腔下方的衬底上。 这些块通过相应的间隙彼此分开，并且在特定块内，各个二极管通过位于它们之间的第一STI沟槽彼此电绝缘。

公开(公告)号：US08485041B2

公开(公告)日：2013-07-16

申请号：US12737966

申请日：2009-07-10

申请人： Marcus Ahles ,  Hubert Benzel ,  Heribert Weber

发明人： Marcus Ahles ,  Hubert Benzel ,  Heribert Weber

IPC分类号： G01L7/00 ,  H01L29/84

CPC分类号： G01L9/0045 ,  G01L13/025

摘要： A sensor system, e.g., a pressure sensor system, includes a substrate having at least one trench on a first side. The trench is provided for forming a first diaphragm region on a second side opposite from the first side. In addition, a second diaphragm region and a cavern are integrated into the material of the first diaphragm region.

摘要翻译： 传感器系统，例如压力传感器系统，包括在第一侧具有至少一个沟槽的衬底。 沟槽被设置用于在与第一侧相对的第二侧上形成第一膜片区域。 此外，第二隔膜区域和洞穴被整合到第一隔膜区域的材料中。

公开(公告)号：US08405210B2

公开(公告)日：2013-03-26

申请号：US12677068

申请日：2008-07-24

申请人： Torsten Kramer ,  Matthias Boehringer ,  Stefan Pinter ,  Hubert Benzel ,  Matthias Illing ,  Frieder Haag ,  Simon Ambruster

发明人： Torsten Kramer ,  Matthias Boehringer ,  Stefan Pinter ,  Hubert Benzel ,  Matthias Illing ,  Frieder Haag ,  Simon Ambruster

IPC分类号： H01L23/498

CPC分类号： H01L21/78 ,  B81C1/00896 ,  B81C2201/053

摘要： A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated.

摘要翻译： 一种芯片的制造方法，其中在晶片复合体中进行尽可能多的方法步骤，即对于设置在晶片上的多个芯片并行。 这是用于制造多个芯片的方法，其功能是基于基板的表面层来实现的。 在该方法中，对表面层进行图案化，并且在表面层下方产生至少一个空腔，使得单独的芯片区域仅通过悬挂网彼此连接和/或连接到基板的其余部分，和/或 单个芯片区域通过腔体区域中的支撑元件连接到腔体下方的衬底层。 当碎片分离时，悬挂网和/或支撑元件被切割。 在芯片分离之前，将衬底的图案和底切表面层嵌入塑料块中。

公开(公告)号：US08389327B2

公开(公告)日：2013-03-05

申请号：US12736721

申请日：2008-12-02

申请人： Torsten Kramer ,  Matthias Boehringer ,  Stefan Pinter ,  Hubert Benzel ,  Matthias Illing ,  Frieder Haag ,  Simon Armbruster

发明人： Torsten Kramer ,  Matthias Boehringer ,  Stefan Pinter ,  Hubert Benzel ,  Matthias Illing ,  Frieder Haag ,  Simon Armbruster

IPC分类号： H01L21/50

CPC分类号： H01L25/50 ,  B81C1/0038 ,  B81C2201/0191 ,  H01L21/02002 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05599 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941

摘要： A method for manufacturing chips (1, 2), in which at least one diaphragm (11, 12) is produced in the surface layer of a semiconductor substrate (10) spanning a cavity (13). The functionality of the chip (1, 2) is then integrated into the diaphragm (11, 12). In order to separate the chip (1, 2), the diaphragm (11, 12) is detached from the substrate composite. The method according to the present invention is characterized by metal plating of the back of the chip (1, 2) in an electroplating process before the chip is separated.

摘要翻译： 一种制造芯片（1,2）的方法，其中在跨越空腔（13）的半导体衬底（10）的表面层中产生至少一个隔膜（11,12）。 然后将芯片（1,2）的功能集成到隔膜（11,12）中。 为了分离芯片（1,2），隔膜（11,12）与基片复合体分离。 根据本发明的方法的特征在于在芯片分离之前在电镀工艺中对芯片（1,2）的背面进行金属电镀。

公开(公告)号：US20120068356A1

公开(公告)日：2012-03-22

申请号：US13199748

申请日：2011-09-07

申请人： Marcus Ahles ,  Jochen Reinmuth ,  Hubert Benzel ,  Simon Armbruster

发明人： Marcus Ahles ,  Jochen Reinmuth ,  Hubert Benzel ,  Simon Armbruster

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  B81B2201/0264 ,  B81C1/00095 ,  H01L21/764 ,  H01L21/7682 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap.

摘要翻译： 具有通孔的部件包括：（i）具有第一通孔部分，第一沟槽结构和第一环绕层部分的第一层，所述第一通孔部分由所述第一沟槽结构与所述第一环绕层部分分离; （ii）具有第二通孔部分，第二沟槽结构和第二包围层部分的第二层，所述第二通孔部分由所述第二沟槽结构与所述第二环绕层部分分离; （iii）设置在第一和第二层之间的绝缘层，绝缘层具有开口，使得第一和第二层的第一和第二通孔部分在开口区域中彼此直接连接。 第一通孔部分和第二周围层部分至少部分重叠。

公开(公告)号：US07872487B2

公开(公告)日：2011-01-18

申请号：US12276572

申请日：2008-11-24

申请人： Holger Ross ,  Hubert Benzel ,  Roland Guenschel ,  Harald Guenschel

发明人： Holger Ross ,  Hubert Benzel ,  Roland Guenschel ,  Harald Guenschel

IPC分类号： G01R31/02 ,  G01R31/26

CPC分类号： H01L22/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.

摘要翻译： 在晶片复合体中的传感器元件的测量中，由此将非电刺激施加到传感器元件，具有多个传感器元件的半导体晶片，每个传感器元件具有电压供应连接，接地连接和 至少一个传感器信号输出被配置为使得总线系统集成在半导体晶片中，至少连接传感器元件的接地连接的总线系统并且经由该总线系统可以将电源电压施加到传感器元件，以及 每个传感器元件配备有用于选择传感器元件的至少一个可控开关元件，使得仅一个选定的传感器元件将传感器信号提供给诊断装置。

公开(公告)号：US07843025B2

公开(公告)日：2010-11-30

申请号：US12359904

申请日：2009-01-26

申请人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

发明人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

IPC分类号： H01L21/00

CPC分类号： B81B3/007 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00658 ,  B81C2201/0115 ,  B81C2201/0116 ,  B81C2201/0136

摘要： A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is arranged such that it allows access to a first region in the semiconductor substrate, the first region having a first doping. Furthermore, a selective removal of at least a portion of the semiconductor material having the first doping out of the first region of the semiconductor substrate is provided. In addition, a membrane is produced above the first region using a first epitaxy layer applied on the stabilizing element. In a further method step, at least a portion of the first region is used to produce a cavity underneath the stabilizing element. In this manner, the present invention provides for the production of the patterned stabilizing element by means of a second epitaxy layer, which is applied on the semiconductor substrate.

摘要翻译： 微机电半导体元件的制造方法包括在半导体衬底上提供具有至少一个开口的图案化稳定元件。 开口被布置成使得其允许接近半导体衬底中的第一区域，第一区域具有第一掺杂。 此外，提供了选择性地去除半导体衬底的第一区域中具有第一掺杂的半导体材料的至少一部分。 此外，使用施加在稳定元件上的第一外延层，在第一区域上方产生膜。 在另一方法步骤中，第一区域的至少一部分用于在稳定元件下方产生空腔。 以这种方式，本发明提供了通过施加在半导体衬底上的第二外延层来生产图案化的稳定元件。

公开(公告)号：US07755152B2

公开(公告)日：2010-07-13

申请号：US12490762

申请日：2009-06-24

申请人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

发明人： Hubert Benzel ,  Frank Schaefer ,  Simon Armbruster ,  Gerhard Lammel ,  Christoph Schelling ,  Joerg Brasas

IPC分类号： H01L29/84

CPC分类号： B81C1/00182 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0115

摘要： A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces.

摘要翻译： 微机械振动膜传感器的制造方法包括提供具有至少部分地位于隔膜下方的第一区域，隔膜和空腔的半导体基板。 在第一区域的至少一部分上方，在半导体衬底的表面中或表面上产生第二区域，第二区域的至少一部分被设置为十字形。 隔膜由沉积的密封层形成，并且包括至少一部分挡条。