发明申请
- 专利标题： CHIP PACKAGE STRUCTURE
- 专利标题（中）： 芯片包装结构
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申请号： US12212173申请日： 2008-09-17
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公开(公告)号： US20090267229A1公开(公告)日： 2009-10-29
- 发明人: Hung-Che SHEN
- 申请人： Hung-Che SHEN
- 优先权： TW097115044 20080424
- 主分类号： H01L23/488
- IPC分类号： H01L23/488
摘要：
A chip package structure is provided. The chip package structure comprises different layers of leads electrically connected to different circuits of a chip. The chip package structure comprises a chip and a flexible substrate layer. The chip has an active surface, a plurality of first pads, and a plurality of second pads. The first pads and the second pads are disposed on the active surface. The flexible substrate layer has a first conductive layer, a second conductive layer, a first surface, and a second surface opposite the first surface. The flexible substrate layer has an opening defined therein. The first conductive layer is formed on the first surface of the flexible substrate layer. The first conductive layer includes a plurality of first leads. The first leads electrically connect to the first pads. The second conductive layer is formed on the second surface of the flexible substrate layer. The second conductive layer includes a plurality of second leads. The second leads extend inwards into the opening and electrically connect to the second pads through the opening.
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