公开(公告)号：US20090267229A1

公开(公告)日：2009-10-29

申请号：US12212173

申请日：2008-09-17

申请人： Hung-Che SHEN

发明人： Hung-Che SHEN

IPC分类号： H01L23/488

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/50 ,  H01L24/73 ,  H01L24/86 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2224/05599

摘要： A chip package structure is provided. The chip package structure comprises different layers of leads electrically connected to different circuits of a chip. The chip package structure comprises a chip and a flexible substrate layer. The chip has an active surface, a plurality of first pads, and a plurality of second pads. The first pads and the second pads are disposed on the active surface. The flexible substrate layer has a first conductive layer, a second conductive layer, a first surface, and a second surface opposite the first surface. The flexible substrate layer has an opening defined therein. The first conductive layer is formed on the first surface of the flexible substrate layer. The first conductive layer includes a plurality of first leads. The first leads electrically connect to the first pads. The second conductive layer is formed on the second surface of the flexible substrate layer. The second conductive layer includes a plurality of second leads. The second leads extend inwards into the opening and electrically connect to the second pads through the opening.

摘要翻译： 提供了芯片封装结构。 芯片封装结构包括电连接到芯片的不同电路的不同层的引线。 芯片封装结构包括芯片和柔性衬底层。 芯片具有有源表面，多个第一焊盘和多个第二焊盘。 第一焊盘和第二焊盘设置在有源表面上。 柔性基板层具有第一导电层，第二导电层，第一表面和与第一表面相对的第二表面。 柔性基底层具有限定在其中的开口。 第一导电层形成在柔性基板层的第一表面上。 第一导电层包括多个第一引线。 第一引线电连接到第一焊盘。 第二导电层形成在柔性基板层的第二表面上。 第二导电层包括多个第二引线。 第二引线向内延伸到开口中，并通过开口电连接到第二焊盘。