发明申请
US20090275156A1 Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof
审中-公开
发光氮化镓系III-V族化合物半导体器件及其制造方法
- 专利标题: Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof
- 专利标题(中): 发光氮化镓系III-V族化合物半导体器件及其制造方法
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申请号: US12458482申请日: 2009-07-14
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公开(公告)号: US20090275156A1公开(公告)日: 2009-11-05
- 发明人: Kuo-Chin Huang , Shyi-Ming Pan , Cheng-Kuo Huang , Chi-Yang Chuang , Fen-Ren Chien
- 申请人: Kuo-Chin Huang , Shyi-Ming Pan , Cheng-Kuo Huang , Chi-Yang Chuang , Fen-Ren Chien
- 优先权: TW096120865 20070608
- 主分类号: H01L21/20
- IPC分类号: H01L21/20
摘要:
A light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof are disclosed. The light emitting device includes a substrate, a n-type semiconductor layer over the substrate, an active layer over the n-type semiconductor layer, a p-type semiconductor layer over the active layer, a conductive layer over the p-type semiconductor layer, a first electrode disposed on the conductive layer and a second electrode arranged on exposed part of the n-type semiconductor layer. A resistant reflective layer or a contact window is disposed on the p-type semiconductor layer, corresponding to the first electrode so that current passes beside the resistant reflective layer or by the contact window to the active layer for generating light. When the light is transmitted to the conductive layer for being emitted, it is not absorbed or shielded by the first electrode. Thus the current is distributed efficiently over the conductive layer. Therefore, both LED brightness and efficiency are improved. Moreover, adhesion between the conductive layer and the p-type semiconductor layer is improved so that metal peel-off problem during manufacturing processes can be improved.
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