Invention Application
US20090294803A1 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
有权
用于制作和组装可印刷的半导体元件的方法和装置
- Patent Title: METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
- Patent Title (中): 用于制作和组装可印刷的半导体元件的方法和装置
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Application No.: US11145574Application Date: 2005-06-02
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Publication No.: US20090294803A1Publication Date: 2009-12-03
- Inventor: Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
- Applicant: Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of the University of Illinois
- Current Assignee: The Board of Trustees of the University of Illinois
- Current Assignee Address: US IL Urbana
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L27/12 ; H01L21/782 ; H01L21/30 ; H01L29/06 ; H01L29/861
Abstract:
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Public/Granted literature
- US07622367B1 Methods and devices for fabricating and assembling printable semiconductor elements Public/Granted day:2009-11-24
Information query
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