发明申请
- 专利标题： Wafer level camera module and method of manufacturing the same
- 专利标题（中）： 晶圆级相机模块及其制造方法
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申请号： US12285943申请日： 2008-10-16
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公开(公告)号： US20090309177A1公开(公告)日： 2009-12-17
- 发明人: Won Kyu Jeung , Seung Seoup Lee
- 申请人： Won Kyu Jeung , Seung Seoup Lee
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2008-0056789 20080617
- 主分类号： H01L31/18
- IPC分类号： H01L31/18 ; H01L31/0232
摘要：
The present invention relates to a wafer level camera module and a method of manufacturing the same and provides a wafer level camera module including a wafer provided with an image sensor on a top surface; a transparent member bonded to the wafer through anodic bonding to seal the image sensor; a spacer bonded to the transparent member through the anodic bonding by including a window to expose the image sensor; and a wafer lens bonded to the spacer through the anodic bonding to cover the window of the spacer and further a method of manufacturing the same.
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IPC分类:
