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    Wafer level camera module and method of manufacturing the same
    1.
    发明申请
    Wafer level camera module and method of manufacturing the same 审中-公开
    晶圆级相机模块及其制造方法

    公开(公告)号：US20090309177A1

    公开(公告)日：2009-12-17

    申请号：US12285943

    申请日：2008-10-16

    申请人： Won Kyu Jeung ,  Seung Seoup Lee

    发明人： Won Kyu Jeung ,  Seung Seoup Lee

    IPC分类号： H01L31/18 ,  H01L31/0232

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention relates to a wafer level camera module and a method of manufacturing the same and provides a wafer level camera module including a wafer provided with an image sensor on a top surface; a transparent member bonded to the wafer through anodic bonding to seal the image sensor; a spacer bonded to the transparent member through the anodic bonding by including a window to expose the image sensor; and a wafer lens bonded to the spacer through the anodic bonding to cover the window of the spacer and further a method of manufacturing the same.

    摘要翻译： 晶片级摄像机模块及其制造方法技术领域本发明涉及晶圆级摄像机模块及其制造方法，并提供晶片级相机模块，其包括在顶面上设置有图像传感器的晶片; 通过阳极接合与晶片接合以密封图像传感器的透明构件; 通过包括窗口以暴露图像传感器通过阳极接合而结合到透明构件的间隔件; 以及通过阳极接合而结合到间隔件的晶片透镜，以覆盖间隔物的窗口，并且还提供了制造该间隔物的方法。

    Inertial sensor and angular velocity detection method using the same
    5.
    发明授权
    Inertial sensor and angular velocity detection method using the same 有权
    惯性传感器和角速度检测方法使用相同

    公开(公告)号：US08789418B2

    公开(公告)日：2014-07-29

    申请号：US13591335

    申请日：2012-08-22

    申请人： Jong Woon Kim ,  Liwei Lin ,  Minyao Mao ,  Won Kyu Jeung

    发明人： Jong Woon Kim ,  Liwei Lin ,  Minyao Mao ,  Won Kyu Jeung

    IPC分类号： G01C19/56

    CPC分类号： G01C19/574

    摘要： Disclosed herein is an inertial sensor. The inertial sensor includes: a plurality of driving masses; support bodies connecting a connection bridge so as to support the driving masses; a connection bridge connecting the plurality of driving masses and connecting the plurality of driving masses with the support bodies; and an electrode pattern part including driving electrodes simultaneously driving the driving masses and sensing electrode detecting axial Coriolis force of each of the driving masses.

    摘要翻译： 这里公开了惯性传感器。 惯性传感器包括：多个驱动质量块; 支撑体连接连接桥，以支撑驱动块; 连接所述多个驱动块并将所述多个驱动块与所述支撑体连接的连接桥; 以及电极图案部，其包括驱动电极，同时驱动驱动质量，感测电极检测每个驱动质量块的轴向科里奥利力。

    Inertial sensor and angular velocity detection method using the same
    6.
    发明授权
    Inertial sensor and angular velocity detection method using the same 有权
    惯性传感器和角速度检测方法使用相同

    公开(公告)号：US08789417B2

    公开(公告)日：2014-07-29

    申请号：US13303334

    申请日：2011-11-23

    申请人： Jong Woon Kim ,  Heung Woo Park ,  Won Kyu Jeung

    发明人： Jong Woon Kim ,  Heung Woo Park ,  Won Kyu Jeung

    IPC分类号： G01C19/56

    CPC分类号： G01P15/08 ,  G01C19/5747 ,  G01P15/18

    摘要： Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other.

    摘要翻译： 本文公开了一种惯性传感器，包括：可移动地由支撑件支撑的驱动部分; 驱动电极使所述驱动部振动; 以及检测电极，其在预定方向上检测作用在所述驱动部件上的力，其中所述驱动部件包括：位于所述惯性传感器的中心的中心驱动质量块; 连接到中心驱动质量块并且与中心驱动质量块互锁的侧驱动质量块，并且基于中心驱动质量被定位在四侧; 以及将中心驱动质量块，侧驱动块和支撑件彼此连接的连接桥。

    INERTIAL SENSOR
    7.
    发明申请
    INERTIAL SENSOR 审中-公开
    惯性传感器

    公开(公告)号：US20120312096A1

    公开(公告)日：2012-12-13

    申请号：US13479522

    申请日：2012-05-24

    申请人： Won Kyu Jeung ,  Jung Won Lee

    发明人： Won Kyu Jeung ,  Jung Won Lee

    IPC分类号： G01P15/02

    CPC分类号： G01C19/5712 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P2015/0865

    摘要： Disclosed herein is an inertial sensor. The inertial sensor 100 according to a preferred embodiment of the present invention includes a membrane including wiring layers that are partitioned into insulating regions and conducting regions, a mass body provided under a central portion of the membrane, and a post provided under an edge of the membrane so as to support the membrane and surrounding the mass body. By this configuration, the membrane is formed as a chief metal core, thereby making it possible to reduce the total manufacturing cost of the inertial sensor and the parasitic capacitance is reduced, thereby making it possible to improve sensitivity of the inertial sensor. Further, the mass body extending from the membrane is made of metals to increase a mass density of the mass body, thereby making it possible to improve the sensitivity of the inertial sensor.

    摘要翻译： 这里公开了惯性传感器。 根据本发明的优选实施例的惯性传感器100包括膜，其包括分隔成绝缘区域和导电区域的布线层，设置在膜的中心部分下方的质量体，以及设置在膜的边缘下方的柱 膜以支撑膜并围绕质量体。 通过这种构造，膜形成为主要金属芯，从而可以降低惯性传感器的总制造成本，并且减小寄生电容，从而可以提高惯性传感器的灵敏度。 此外，从膜延伸的质量体由金属制成，以增加质量体的质量密度，从而可以提高惯性传感器的灵敏度。

    Wafer level package and wafer level packaging method
    8.
    发明申请
    Wafer level package and wafer level packaging method 审中-公开
    晶圆级封装和晶圆级封装方法

    公开(公告)号：US20080283989A1

    公开(公告)日：2008-11-20

    申请号：US12153373

    申请日：2008-05-16

    申请人： Won Kyu Jeung ,  Seog Moon Choi ,  Job Ha ,  Sang Hee Park ,  Tae Hoon Kim

    发明人： Won Kyu Jeung ,  Seog Moon Choi ,  Job Ha ,  Sang Hee Park ,  Tae Hoon Kim

    IPC分类号： H01L23/055 ,  H01L21/54

    CPC分类号： H01L23/26 ,  H01L23/055 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices. In the wafer level package, a device substrate includes a device region, where a device is formed, and internal pads on the top surface. The internal pads are electrically connected to the device. A cap substrate includes a getter corresponding to the device on the bottom surface. A plurality of sealing/attaching members are provided between the device substrate and the cap substrate to attach the device substrate and the cap substrate and seal the device region and the getter. The sealing/attaching members are formed of polymer. A plurality of vias penetrate the cap substrate and are connected to the internal pads. The getter provided in the sealed space defined by the sealing/attaching members can prevent the devices of the device region from being contaminated by moisture or foreign particles generated during the fabrication process, and the sealing/attaching process can be performed at a lower temperature compared with a typical sealing/attaching process using a metal.

    摘要翻译： 提供了能够在低温下执行附着处理并防止内部装置的污染的晶片级封装和晶片级封装方法。 在晶片级封装中，器件衬底包括其中形成器件的器件区域和顶表面上的内部焊盘。 内部焊盘电连接到设备。 盖基板包括对应于底表面上的装置的吸气剂。 在装置基板和盖基板之间设置多个密​​封/附接构件，以附接装置基板和盖基板，并密封装置区域和吸气剂。 密封/附接构件由聚合物形成。 多个通孔穿过盖基板并连接到内部焊盘。 设置在由密封/附接构件限定的密封空间中的吸气剂可以防止装置区域的装置被制造过程中产生的湿气或异物污染，并且密封/附着过程可以在较低的温度下进行比较 具有典型的使用金属的密封/附着工艺。

    INERTIAL SENSOR AND ANGULAR VELOCITY DETECTION METHOD USING THE SAME
    10.
    发明申请
    INERTIAL SENSOR AND ANGULAR VELOCITY DETECTION METHOD USING THE SAME 有权
    惯性传感器和使用其的角速度检测方法

    公开(公告)号：US20130081465A1

    公开(公告)日：2013-04-04

    申请号：US13591335

    申请日：2012-08-22

    申请人： Jong Woon Kim ,  Liwei Lin ,  Minyao Mao ,  Won Kyu Jeung

    发明人： Jong Woon Kim ,  Liwei Lin ,  Minyao Mao ,  Won Kyu Jeung

    IPC分类号： G01C19/56

    CPC分类号： G01C19/574

    摘要： Disclosed herein is an inertial sensor. The inertial sensor includes: a plurality of driving masses; support bodies supporting the driving masses so as to freely move in a state in which the driving masses float; a connection bridge connecting the plurality of driving masses and connecting the plurality of driving masses with the support bodies; and an electrode pattern part including driving electrodes simultaneously driving the driving masses and sensing electrode detecting axial Coriolis force of each of the driving masses.

    摘要翻译： 这里公开了惯性传感器。 惯性传感器包括：多个驱动质量块; 支撑驱动质量的支撑体，以便在驱动质量浮动的状态下自由移动; 连接所述多个驱动块并将所述多个驱动块与所述支撑体连接的连接桥; 以及电极图案部，其包括驱动电极，同时驱动驱动质量，感测电极检测每个驱动质量块的轴向科里奥利力。