发明申请
US20090316373A1 PCB having chips embedded therein and method of manfacturing the same
审中-公开
具有嵌入芯片的PCB及其制造方法
- 专利标题: PCB having chips embedded therein and method of manfacturing the same
- 专利标题(中): 具有嵌入芯片的PCB及其制造方法
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申请号: US12230942申请日: 2008-09-08
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公开(公告)号: US20090316373A1公开(公告)日: 2009-12-24
- 发明人: Dong Kuk Kim , Tae Hyun Kim
- 申请人: Dong Kuk Kim , Tae Hyun Kim
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO. LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO. LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2008-0057851 20080619
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K3/36
摘要:
Provided is a PCB having chips embedded therein, the PCB including a first core substrate that has a first chip embedded therein, the first chip having a plurality of first pads provided on the top surface thereof, and first circuit patterns provided on both surfaces thereof; a second core substrate that is disposed under the first core substrate so as to be spaced at a predetermined space from the first core substrate and has a second chip embedded therein, the second chip having a plurality of second pads provided on the bottom surface thereof, and second circuit patterns provided on both surfaces thereof; a first insulating layer that is laminated on the first core substrate and has a plurality of first conductive bumps formed therein, the first conductive bumps passing through the first insulating layer and being connected to the first circuit patterns and the first pads; a second insulating layer that is laminated between the first core substrate and the second core substrate and has a plurality of second conductive bumps formed therein, the second conductive bumps passing through the second insulating layer and connecting the first circuit patterns to the second circuit patterns; and a third insulating layer that is laminated under the second core substrate and has a plurality of third conductive bumps formed therein, the third conductive bumps passing through the third insulating layer and being connected to the second circuit patterns and the second pads.