发明申请
- 专利标题： SYSTEM-IN-PACKAGE MODULE AND MOBILE TERMINAL HAVING THE SAME
- 专利标题（中）： 系统级封装模块和具有该模块的移动终端
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申请号： US12232251申请日： 2008-09-12
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公开(公告)号： US20100002407A1公开(公告)日： 2010-01-07
- 发明人: Tae Hyun Kim , Sung Taek Kwon , Tae Ha Lee , Dong Kuk Kim
- 申请人： Tae Hyun Kim , Sung Taek Kwon , Tae Ha Lee , Dong Kuk Kim
- 申请人地址： KR SUWON
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR SUWON
- 优先权： KR10-2008-0064878 20080704
- 主分类号： H05K7/02
- IPC分类号： H05K7/02
摘要：
Provided is a system-in-package module including a system circuit board; a first element that is disposed on the system circuit board; a second element that is disposed on the first element so as to be shifted to one side from the center of the first element, while partially exposing the first element; a third element that is electrically connected to the system circuit board and is disposed on the second element; and a plurality of bump pads that are disposed on the bottom surface of the system circuit board.
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