公开(公告)号：US20100002407A1

公开(公告)日：2010-01-07

申请号：US12232251

申请日：2008-09-12

申请人： Tae Hyun Kim ,  Sung Taek Kwon ,  Tae Ha Lee ,  Dong Kuk Kim

发明人： Tae Hyun Kim ,  Sung Taek Kwon ,  Tae Ha Lee ,  Dong Kuk Kim

IPC分类号： H05K7/02

CPC分类号： H01L24/33 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided is a system-in-package module including a system circuit board; a first element that is disposed on the system circuit board; a second element that is disposed on the first element so as to be shifted to one side from the center of the first element, while partially exposing the first element; a third element that is electrically connected to the system circuit board and is disposed on the second element; and a plurality of bump pads that are disposed on the bottom surface of the system circuit board.

摘要翻译： 提供了一种包括系统电路板的系统级封装模块; 布置在所述系统电路板上的第一元件; 第二元件，其设置在第一元件上，以便从第一元件的中心偏移到一侧，同时部分地暴露第一元件; 电连接到所述系统电路板并设置在所述第二元件上的第三元件; 以及设置在所述系统电路板的底面上的多个凸点焊盘。

公开(公告)号：US07679928B2

公开(公告)日：2010-03-16

申请号：US12232251

申请日：2008-09-12

申请人： Tae Hyun Kim ,  Sung Taek Kwon ,  Tae Ha Lee ,  Dong Kuk Kim

发明人： Tae Hyun Kim ,  Sung Taek Kwon ,  Tae Ha Lee ,  Dong Kuk Kim

IPC分类号： H05K7/10

CPC分类号： H01L24/33 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided is a system-in-package module including a system circuit board; a first element that is disposed on the system circuit board; a second element that is disposed on the first element so as to be shifted to one side from the center of the first element, while partially exposing the first element; a third element that is electrically connected to the system circuit board and is disposed on the second element; and a plurality of bump pads that are disposed on the bottom surface of the system circuit board.

摘要翻译： 提供了一种包括系统电路板的系统级封装模块; 布置在所述系统电路板上的第一元件; 第二元件，其设置在第一元件上，以便从第一元件的中心偏移到一侧，同时部分地暴露第一元件; 电连接到所述系统电路板并设置在所述第二元件上的第三元件; 以及设置在所述系统电路板的底面上的多个凸点焊盘。