发明申请
- 专利标题: METHOD OF MANUFACTURING SEMICONDUCTOR LASER
- 专利标题(中): 制造半导体激光的方法
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申请号: US12274435申请日: 2008-11-20
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公开(公告)号: US20100003778A1公开(公告)日: 2010-01-07
- 发明人: Hitoshi Tada , Tsutomu Yamaguchi , Zempei Kawazu , Yuji Okura
- 申请人: Hitoshi Tada , Tsutomu Yamaguchi , Zempei Kawazu , Yuji Okura
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-176771 20080707
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A method of manufacturing a semiconductor laser includes sequentially forming a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on top of one another on a semiconductor substrate; forming a ridge in the second conductivity type semiconductor layer; forming a first insulating film on the second conductivity type semiconductor layer at a first temperature; forming a second insulating film on the first insulating film at a second temperature, lower than the first temperature; and forming an electrode on the second insulating film.
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