发明申请
- 专利标题: MAGNETIC FIELD GENERATION CONTROL UNIT AND MAGNETRON SPUTTERING APPARATUS AND METHOD USING THE SAME
- 专利标题(中): 磁场发生控制单元和磁控溅射装置及其使用方法
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申请号: US12481239申请日: 2009-06-09
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公开(公告)号: US20100006423A1公开(公告)日: 2010-01-14
- 发明人: Yun-Mo CHUNG , Ki-Yong Lee , Min-Jae Jeong , Heung-Yeol Na , Jong-Won Hong , Eu-Gene Kang
- 申请人: Yun-Mo CHUNG , Ki-Yong Lee , Min-Jae Jeong , Heung-Yeol Na , Jong-Won Hong , Eu-Gene Kang
- 申请人地址: KR Yongin-City
- 专利权人: Samsung Mobile Display Co. Ltd.
- 当前专利权人: Samsung Mobile Display Co. Ltd.
- 当前专利权人地址: KR Yongin-City
- 优先权: KR2008-66723 20080709
- 主分类号: C23C14/35
- IPC分类号: C23C14/35
摘要:
A magnetic field generation control unit and a magnetron sputtering apparatus and method using the magnetic field generation control circuit. The magnetic field generation control unit includes a magnetic field generator for providing a specific magnetic field to a target consisting of a metal material to be deposited on a substrate, and a magnetic field generator control module electrically connected with the magnetic field generator, receiving an electrical signal from outside, and selectively supplying a current capable of generating the magnetic field to the magnetic field generator. The target is prevented from being magnetized when a sputtering process is not performed, and the magnetic field is generated from the target when the process is performed. Consequently, it is possible to perform uniform deposition on the substrate.