Apparatus for reading identification information of biosensor
    2.
    发明授权
    Apparatus for reading identification information of biosensor 有权
    用于读取生物传感器识别信息的装置

    公开(公告)号:US09044756B2

    公开(公告)日:2015-06-02

    申请号:US13588025

    申请日:2012-08-17

    IPC分类号: B01L3/00 G01N33/487 G01N35/00

    摘要: An apparatus for reading identification information of a biosensor is provided, including a biosensor sensing unit detecting the biosensor, a light-emitting unit emitting light on an identification information recording unit when the biosensor sensing unit detects the biosensor, the identification information recording unit having the identification information of the biosensor recorded thereon, a light-receiving unit that receives the light emitted from the light-emitting unit, and reflected or refracted by or passing through the identification information recording section, and an identification information reading unit analyzing the light received by the light-receiving unit and reading the identification information of the biosensor.

    摘要翻译: 提供一种用于读取生物传感器的识别信息的装置,包括检测生物传感器的生物传感器感测单元,当生物传感器感测单元检测到生物传感器时在识别信息记录单元上发光的发光单元,具有 记录在其上的生物传感器的识别信息,接收从发光单元发射并被识别信息记录部分反射或折射或通过的光的光接收单元,以及识别信息读取单元, 光接收单元并读取生物传感器的识别信息。

    Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
    3.
    发明授权
    Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same 有权
    薄膜沉积装置及使用该有机发光显示装置的方法

    公开(公告)号:US08865252B2

    公开(公告)日:2014-10-21

    申请号:US13031756

    申请日:2011-02-22

    摘要: A thin film deposition apparatus that can be easily used to manufacture large-sized display devices on a mass scale and that improves manufacturing yield, and a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus. The thin film deposition apparatus includes: a loading unit to place a substrate, which is a deposition target, on an electrostatic chuck; a deposition unit including a chamber, and a thin film deposition assembly that is disposed in the chamber and forms a thin film on the substrate placed on the electrostatic chuck; an unloading unit to separate the substrate on which deposition is completed from the electrostatic chuck; a first conveyor unit to sequentially move the electrostatic chuck having the substrate thereon to the loading unit, to the deposition unit, and finally, to the unloading unit, wherein the first conveyor unit includes: one pair of first guide rails and one pair of second guide rails disposed in parallel; at least one first guide block engaged with the first guide rails, respectively; and at least one second guide block engaged with the second guide rails, respectively.

    摘要翻译: 可以容易地用于大规模制造大尺寸显示装置并提高制造成品率的薄膜沉积装置,以及通过使用薄膜沉积装置制造有机发光显示装置的方法。 薄膜沉积装置包括:装载单元,将作为沉积靶的基板放置在静电卡盘上; 包括室的沉积单元和设置在室中并在放置在静电卡盘上的基板上形成薄膜的薄膜沉积组件; 卸载单元,用于将其上完成了沉积的基板从静电卡盘分离; 第一传送单元,其顺序地将其上具有基板的静电卡盘移动到装载单元,到沉积单元,最后到达卸载单元,其中第一传送单元包括:一对第一导轨和一对第二传送单元 平行布置的导轨; 分别与所述第一导轨接合的至少一个第一引导块; 以及分别与第二导轨接合的至少一个第二引导块。

    Methods of forming metal interconnection structures
    5.
    发明授权
    Methods of forming metal interconnection structures 有权
    形成金属互连结构的方法

    公开(公告)号:US08124524B2

    公开(公告)日:2012-02-28

    申请号:US12711812

    申请日:2010-02-24

    IPC分类号: H01L21/4763

    摘要: Methods of forming a metal interconnection structure are provided. The methods include forming an insulating layer on a semiconductor substrate including a first metal interconnection. The insulating layer is patterned to form an opening that exposes the first metal interconnection. A first diffusion barrier layer is formed on the exposed first metal interconnection. After forming the first diffusion barrier layer, a second diffusion barrier layer is formed on the first diffusion barrier layer in the opening, the second diffusion barrier layer contacting a sidewall of the opening. A second metal interconnection is formed on the second diffusion barrier layer.

    摘要翻译: 提供形成金属互连结构的方法。 所述方法包括在包括第一金属互连的半导体衬底上形成绝缘层。 图案化绝缘层以形成露出第一金属互连的开口。 在暴露的第一金属互连上形成第一扩散阻挡层。 在形成第一扩散阻挡层之后,在开口中的第一扩散阻挡层上形成第二扩散阻挡层,第二扩散阻挡层与开口的侧壁接触。 第二金属互连形成在第二扩散阻挡层上。

    THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME
    7.
    发明申请
    THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME 有权
    薄膜沉积装置及使用其制造有机发光显示装置的方法

    公开(公告)号:US20110244120A1

    公开(公告)日:2011-10-06

    申请号:US13031756

    申请日:2011-02-22

    摘要: A thin film deposition apparatus that can be easily used to manufacture large-sized display devices on a mass scale and that improves manufacturing yield, and a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus. The thin film deposition apparatus includes: a loading unit to place a substrate, which is a deposition target, on an electrostatic chuck; a deposition unit including a chamber, and a thin film deposition assembly that is disposed in the chamber and forms a thin film on the substrate placed on the electrostatic chuck; an unloading unit to separate the substrate on which deposition is completed from the electrostatic chuck; a first conveyor unit to sequentially move the electrostatic chuck having the substrate thereon to the loading unit, to the deposition unit, and finally, to the unloading unit, wherein the first conveyor unit includes: one pair of first guide rails and one pair of second guide rails disposed in parallel; at least one first guide block engaged with the first guide rails, respectively; and at least one second guide block engaged with the second guide rails, respectively.

    摘要翻译: 可以容易地用于大规模制造大尺寸显示装置并提高制造成品率的薄膜沉积装置,以及通过使用薄膜沉积装置制造有机发光显示装置的方法。 薄膜沉积装置包括:装载单元,将作为沉积靶的基板放置在静电卡盘上; 包括室的沉积单元和设置在室中并在放置在静电卡盘上的基板上形成薄膜的薄膜沉积组件; 卸载单元,用于将其上完成了沉积的基板从静电卡盘分离; 第一传送单元,其顺序地将其上具有基板的静电卡盘移动到装载单元,到沉积单元,最后到达卸载单元,其中第一传送单元包括:一对第一导轨和一对第二传送单元 平行布置的导轨; 分别与所述第一导轨接合的至少一个第一引导块; 以及分别与第二导轨接合的至少一个第二引导块。

    Method of manufacturing a semiconductor device
    8.
    发明授权
    Method of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07972941B2

    公开(公告)日:2011-07-05

    申请号:US12165805

    申请日:2008-07-01

    IPC分类号: H01L21/322

    摘要: A gate structure is formed on a substrate. An insulating interlayer is formed covering the gate structure. The substrate is heat treated while exposing a surface of the insulating interlayer to a hydrogen gas atmosphere. A silicon nitride layer is formed directly on the interlayer insulating layer after the heat treatment and a metal wiring is formed on the insulating interlayer. The metal wiring may include copper. Heat treating the substrate while exposing a surface of the interlayer insulating layer to a hydrogen gas atmosphere may be preceded by forming a plug through the first insulating interlayer that contacts the substrate, and the metal wiring may be electrically connected to the plug. The plug may include tungsten.

    摘要翻译: 在基板上形成栅极结构。 形成覆盖栅极结构的绝缘中间层。 在将绝缘中间层的表面暴露于氢气气氛的同时对基板进行热处理。 在热处理之后,在层间绝缘层上直接形成氮化硅层,在绝缘中间层上形成金属配线。 金属布线可以包括铜。 在将层间绝缘层的表面暴露于氢气气氛的同时对基板进行热处理之前,可以通过与基板接触的第一绝缘中间层形成插塞,并且金属布线可以电连接到插头。 插头可以包括钨。