发明申请
US20100012488A1 SPUTTER TARGET ASSEMBLY HAVING A LOW-TEMPERATURE HIGH-STRENGTH BOND
审中-公开
具有低温高强度粘结剂的溅射器目标组件
- 专利标题： SPUTTER TARGET ASSEMBLY HAVING A LOW-TEMPERATURE HIGH-STRENGTH BOND
- 专利标题（中）： 具有低温高强度粘结剂的溅射器目标组件
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申请号： US12173557申请日： 2008-07-15
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公开(公告)号： US20100012488A1公开(公告)日： 2010-01-21
- 发明人: Holger J. Koenigsmann , Chi-Fung Lo , Paul S. Gilman
- 申请人： Holger J. Koenigsmann , Chi-Fung Lo , Paul S. Gilman
- 主分类号： C23C14/00
- IPC分类号： C23C14/00 ; B32B37/00
摘要：
Sputter target assemblies are disclosed, wherein the target and the backing plate are joined together through brazing at low temperatures to produce a superior bond between the target and the backing plate.
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