发明申请
- 专利标题： Assembling of Electronic Members on IC Chip
- 专利标题（中）： IC芯片上电子元件的组装
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申请号： US12539122申请日： 2009-08-11
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公开(公告)号： US20100032802A1公开(公告)日： 2010-02-11
- 发明人: Shinichi Togawa , Mutsumi Masumoto
- 申请人： Shinichi Togawa , Mutsumi Masumoto
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 优先权： JP2008-206669 20080811
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L29/92 ; H01L21/768 ; H01L21/50
摘要：
The objective of this invention is to provide an assembling method for electronic members characterized by the fact that electronic members can be joined reliably and easily without using solder paste. The semiconductor device of the present invention has the following parts: silicon substrate 100 with circuit elements formed on it, plural protrusion-shaped metal electrodes 110A, 110B formed on silicon substrate 100, and capacitor 140 having Au-plated electrodes 142, 144. The electrodes 142, 144 of capacitor 140 are metallurgically joined to protrusion-shaped metal electrodes 110A, 110B by means of ultrasonic thermo-compression bonding.
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