发明申请
US20100033202A1 Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes 审中-公开
用于接触电子元件的悬臂式微孔和制造这种探头的方法

Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes
摘要:
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.
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