发明申请
US20100033202A1 Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes
审中-公开
用于接触电子元件的悬臂式微孔和制造这种探头的方法
- 专利标题: Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes
- 专利标题(中): 用于接触电子元件的悬臂式微孔和制造这种探头的方法
-
申请号: US12507378申请日: 2009-07-22
-
公开(公告)号: US20100033202A1公开(公告)日: 2010-02-11
- 发明人: Richard T. Chen , Vacit Arat , Christopher R. Folk , Adam L. Cohen
- 申请人: Richard T. Chen , Vacit Arat , Christopher R. Folk , Adam L. Cohen
- 专利权人: Microfabrica Inc.
- 当前专利权人: Microfabrica Inc.
- 主分类号: G01R31/02
- IPC分类号: G01R31/02
摘要:
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.
信息查询