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1.发明申请Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes 审中-公开用于接触电子元件的悬臂式微孔和制造这种探头的方法公开(公告)号：US20100033202A1
公开(公告)日：2010-02-11
申请号：US12507378
申请日：2009-07-22
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.
摘要翻译： 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及两部分探针元件，可插座探针及其安装件的各种设计。 一些实施例涉及制造这种探针和支架的方法。 在一些实施例中，例如，探针在安装结构中具有滑动，在安装结构中扭转，包括柔顺元件的安装结构等。
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2.发明申请公开(公告)号：US20090197371A1
公开(公告)日：2009-08-06
申请号：US12349768
申请日：2009-01-07
IPC分类号： H01L21/50
CPC分类号： H01L21/4857 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/07378 , G01R3/00 , H01L23/13 , H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/1461 , H01L2924/15174 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： Embodiments of the invention provide methods for packaging integrated circuits and/or other electronic components with electrochemically fabricated structures which include conductive interconnection elements. In some embodiments the electrochemically produced structures are fabricated on substrates that include conductive vias while in other embodiments, the substrates are solid blocks of conductive material, or conductive material containing passages that allow the flow of fluid to maintain desired thermal properties of the packaged electronic components.
摘要翻译： 本发明的实施例提供了用于封装集成电路和/或具有包括导电互连元件的电化学制造的结构的其它电子部件的方法。 在一些实施例中，电化学产生的结构被制造在包括导电通孔的衬底上，而在其他实施例中，衬底是导电材料的固体块，或者包含允许流体流动保持封装的电子部件的期望热性能的导电材料 。
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公开(公告)号：US20100155253A1
公开(公告)日：2010-06-24
申请号：US12631632
申请日：2009-12-04
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
CPC分类号： G01R1/0483 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06716 , G01R1/06744 , G01R1/07314 , G01R1/07357 , G01R3/00 , G01R31/2886 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T156/10 , H01L2924/00
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。
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公开(公告)号：US07504840B2
公开(公告)日：2009-03-17
申请号：US11244817
申请日：2005-10-06
申请人： Vacit Arat , Adam L. Cohen , Dennis R. Smalley , Ezekiel J. J. Kruglick , Richard T. Chen , Kieun Kim
发明人： Vacit Arat , Adam L. Cohen , Dennis R. Smalley , Ezekiel J. J. Kruglick , Richard T. Chen , Kieun Kim
IPC分类号： G01R31/02
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。
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公开(公告)号：US07412767B2
公开(公告)日：2008-08-19
申请号：US11029217
申请日：2005-01-03
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
CPC分类号： G01R1/0483 , G01R1/06716 , G01R1/07357 , G01R31/2886 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49211 , Y10T29/49213
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。
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公开(公告)号：US20080174332A1
公开(公告)日：2008-07-24
申请号：US11928339
申请日：2007-10-30
申请人： Vacit Arat , Adam L. Cohen , Dennis R. Smalley , Ezekiel J.J. Kruglick , Richard T. Chen , Kieun Kim
发明人： Vacit Arat , Adam L. Cohen , Dennis R. Smalley , Ezekiel J.J. Kruglick , Richard T. Chen , Kieun Kim
IPC分类号： G01R31/26
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
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7.发明申请公开(公告)号：US20080157793A1
公开(公告)日：2008-07-03
申请号：US11928739
申请日：2007-10-30
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kievn Kim , Gang Zhang , Dennis R. Smalley
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kievn Kim , Gang Zhang , Dennis R. Smalley
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , A61N1/00 , C25D1/00 , C25D1/003 , G01R1/06722 , G01R1/06744 , G01R1/06761
摘要： Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
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公开(公告)号：US20090066351A1
公开(公告)日：2009-03-12
申请号：US12203102
申请日：2008-09-02
申请人： Vacit Arat , Adam L. Cohen , Dennis R. Smalley , Ezekiel J. J. Kruglick , Richard T. Chen , Kieun Kim
发明人： Vacit Arat , Adam L. Cohen , Dennis R. Smalley , Ezekiel J. J. Kruglick , Richard T. Chen , Kieun Kim
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。
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公开(公告)号：US07273812B2
公开(公告)日：2007-09-25
申请号：US11178145
申请日：2005-07-07
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
IPC分类号： H01L21/44
CPC分类号： C25D1/003 , G01R3/00 , Y10T29/49222
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。
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公开(公告)号：US07241689B2
公开(公告)日：2007-07-10
申请号：US11029169
申请日：2005-01-03
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
IPC分类号： H01L21/44
CPC分类号： H01R13/187 , H01L24/72 , H01L2924/15747 , H01L2924/00
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。
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