发明申请
US20100038009A1 METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER
审中-公开
用于接合保护带到半导体波长的方法和装置
- 专利标题： METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER
- 专利标题（中）： 用于接合保护带到半导体波长的方法和装置
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申请号： US12539476申请日： 2009-08-11
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公开(公告)号： US20100038009A1公开(公告)日： 2010-02-18
- 发明人: Chouhei Okuno , Masayuki Yamamoto , Saburo Miyamoto
- 申请人： Chouhei Okuno , Masayuki Yamamoto , Saburo Miyamoto
- 优先权： JP2008-208110 20080812
- 主分类号： B32B38/00
- IPC分类号： B32B38/00 ; B32B37/00 ; B32B41/00
摘要：
A protective tape is supplied above the surface of a semiconductor wafer, and joined to the surface of the semiconductor wafer by rolling a joining roller while pressing the joining roller against the protective tape. Then the joined protective tape is cut out along the outer periphery of the semiconductor wafer. Subsequently, the protective tape is pressed with the pressure member to flatten the surface of the protective tape.
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