发明申请
- 专利标题: CONFORMAL ADHESION PROMOTER LINER FOR METAL INTERCONNECTS
- 专利标题(中): 用于金属互连的一致粘合促进剂衬里
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申请号: US12190906申请日: 2008-08-13
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公开(公告)号: US20100038789A1公开(公告)日: 2010-02-18
- 发明人: Tien-Jen Cheng , Zhengwen Li , Keith Kwong Hon Wong , Huilong Zhu
- 申请人: Tien-Jen Cheng , Zhengwen Li , Keith Kwong Hon Wong , Huilong Zhu
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L23/532
摘要:
A dielectric layer is patterned with at least one line trough and/or at least one via cavity. A metallic nitride liner is formed on the surfaces of the patterned dielectric layer. A metal liner is formed on the surface of the metallic nitride liner. A conformal copper nitride layer is formed directly on the metal liner by atomic layer deposition (ALD) or chemical vapor deposition (CVD). A Cu seed layer is formed directly on the conformal copper nitride layer. The at least one line trough and/or the at least one via cavity are filled with an electroplated material. The direct contact between the conformal copper nitride layer and the Cu seed layer provides enhanced adhesion strength. The conformal copper nitride layer may be annealed to covert an exposed outer portion into a contiguous Cu layer, which may be employed to reduce the thickness of the Cu seed layer.
公开/授权文献
- US08105937B2 Conformal adhesion promoter liner for metal interconnects 公开/授权日:2012-01-31