发明申请
- 专利标题: BUFFER APPARATUS AND THIN FILM DEPOSITION SYSTEM
- 专利标题(中): 缓冲装置和薄膜沉积系统
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申请号: US12196040申请日: 2008-08-21
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公开(公告)号: US20100043701A1公开(公告)日: 2010-02-25
- 发明人: Cheng-Chung Lim , Zhao-Jin Sun , Jui-Lin Tang , Chin-Khye Pang , Yu-Heng Liu
- 申请人: Cheng-Chung Lim , Zhao-Jin Sun , Jui-Lin Tang , Chin-Khye Pang , Yu-Heng Liu
- 申请人地址: TW Hsinchu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsinchu
- 主分类号: B05C3/02
- IPC分类号: B05C3/02
摘要:
A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole.
公开/授权文献
- US08328938B2 Buffer apparatus and thin film deposition system 公开/授权日:2012-12-11
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