发明申请
US20100062281A1 Coating Liquid, Conductive Film Formed By Coating Liquid, and Forming Method Thereof 有权
涂布液,涂布液形成的导电膜及其成型方法

Coating Liquid, Conductive Film Formed By Coating Liquid, and Forming Method Thereof
摘要:
The present invention provides a technology related to a conductive film which is high in transparency, conductivity, and adhesiveness to a base plate. The present invention also provides a coating liquid including metal materials reacting with a ligand represented by Chemical Formula 1 and including indium (In), tin (Sn), or both thereof. Each of R21—R24 in the Chemical Formula 1 is one of the followings (1)-(11) and X11 and X12 is either hetero atoms or carboxylic acid. (1) a group represented by ClH2l+1 (aforementioned l is an integral number of 0 to 4), (2) a group represented by CmH2m (aforementioned m is an integral number of 2 to 4), (3) a group represented by CnH2n−1 (aforementioned n is an integral number of 2 to 4), (4) a group represented by COOR (aforementioned R is CpH2p+1 (aforementioned p is an integral number of 0 to 4) or a group represented by R═C6H5), (5) a group represented by aldehyde, ketones, COCqH2q+1 (aforementioned q is an integral number of 0 to 4), or benzophenone, (6) hydroxyl (OH) or ethers, (7) amine (NH2) or alkylamine, (8) amide (9) halogens (10) nitrile (CN) (11) nitro (NO2)
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