发明申请
- 专利标题: LASER PROCESSING DEVICE AND ITS PROCESSING METHOD
- 专利标题(中): 激光加工装置及其加工方法
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申请号: US12523290申请日: 2008-01-16
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公开(公告)号: US20100068673A1公开(公告)日: 2010-03-18
- 发明人: Eiichiro Yamada , Akira Inoue , Hitoshi Hatayama
- 申请人: Eiichiro Yamada , Akira Inoue , Hitoshi Hatayama
- 申请人地址: JP Osaka-shi
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka-shi
- 优先权: JP2007-008402 20070117
- 国际申请: PCT/JP2008/050445 WO 20080116
- 主分类号: A61C3/00
- IPC分类号: A61C3/00
摘要:
A laser processing apparatus 1 includes: a processing light source 2 for emitting a processing light for processing a tooth 13A or a gingiva 13B; a halogen lamp 3 for emitting an illumination light for illuminating the tooth 13A or the gingiva 13B; a detector 4 capable of detecting a multiple-wavelength light from the tooth 13A or the gingiva 13B; and a controller 5 for controlling the light-emitting state of the first light-emitting part 2. The detector 4 has a first detection element 6 and a second detection element 7 with light-receiving sensitivities that differ in accordance with wavelength, detects light intensities of different wavelengths, and outputs the detection result to the controller 5. The controller 5 controls the light-emitting state of the processing light source 2 on the basis of the ratio of the respective intensities of the different wavelength light detected by the detector 4.
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