发明申请
US20100075427A1 METHODS OF TREATING A SURFACE TO PROMOTE METAL PLATING AND DEVICES FORMED
审中-公开
处理表面以促进形成金属镀层和器件的方法
- 专利标题： METHODS OF TREATING A SURFACE TO PROMOTE METAL PLATING AND DEVICES FORMED
- 专利标题（中）： 处理表面以促进形成金属镀层和器件的方法
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申请号： US12628985申请日： 2009-12-01
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公开(公告)号： US20100075427A1公开(公告)日： 2010-03-25
- 发明人: Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
- 申请人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
- 主分类号： G01N33/20
- IPC分类号： G01N33/20
摘要：
Embodiments of the present invention provide methods of treating a surface of a substrate. In one embodiment a kit for carrying out the binding of metals to a substrate is provided, comprising: a container comprising a heat-resistant organic molecule derivatized with an attachment group Y and a binding group X, the binding group X promotes binding of metals; and instructional materials teaching coupling the organic molecule to the substrate by heating the molecule and/or the surface to a temperature of at least 25° C.
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