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1.发明申请公开(公告)号：US20090056994A1
公开(公告)日：2009-03-05
申请号：US11848860
申请日：2007-08-31
申请人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
发明人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
CPC分类号： H05K3/389 , C23C18/1653 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/40 , H05K3/181 , H05K3/182 , H05K2203/1105 , H05K2203/121 , Y10T428/24322 , Y10T428/31511 , Y10T428/31678 , Y10T428/31721
摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.
摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。
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2.发明申请Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom 审中-公开处理表面以促进所形成的感兴趣的分子，涂层和器件的结合的方法公开(公告)号：US20090056991A1
公开(公告)日：2009-03-05
申请号：US12201974
申请日：2008-08-29
申请人： Werner G. Kuhr , Steven Z. SHI , Jen-Chieh WEI , Zhiming LIU , Lingyun WEI
发明人： Werner G. Kuhr , Steven Z. SHI , Jen-Chieh WEI , Zhiming LIU , Lingyun WEI
CPC分类号： H05K3/389 , C08J7/065 , C08J7/12 , C09J5/02 , C23C18/1653 , C23C18/1844 , C23C18/1893 , C23C18/2066 , H05K3/181 , H05K3/4611 , H05K2203/1105 , H05K2203/121 , Y02P20/582 , Y10T156/10
摘要： The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various applications including but not limited to electronics manufacturing, printed circuit board manufacturing, metal electroplating, the protection of surfaces against chemical attack, the manufacture of localized conductive coatings, the manufacture of chemical sensors, for example in the fields of chemistry and molecular biology, the manufacture of biomedical equipment, and the like. In another aspect, the present invention provides a printed circuit board, a printed circuit board, comprising: at least one metal layer; a layer of organic molecules attached to the at least one metal layer; and an epoxy layer atop said layer of organic molecules.
摘要翻译： 本发明一般涉及处理基材表面的方法，以及在各种应用中使用该方法和由其形成的膜，涂层和装置，包括但不限于电子制造，印刷电路板制造，金属电镀， 防止化学侵蚀的表面的保护，局部导电涂层的制造，化学传感器的制造，例如在化学和分子生物学领域，生物医学设备的制造等。 另一方面，本发明提供一种印刷电路板，印刷电路板，包括：至少一个金属层; 附着在所述至少一个金属层上的有机分子层; 以及在所述有机分子层顶上的环氧树脂层。
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3.发明申请公开(公告)号：US20100075427A1
公开(公告)日：2010-03-25
申请号：US12628985
申请日：2009-12-01
申请人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
发明人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
IPC分类号： G01N33/20
CPC分类号： H05K3/389 , C23C18/1653 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/40 , H05K3/181 , H05K3/182 , H05K2203/1105 , H05K2203/121 , Y10T428/24322 , Y10T428/31511 , Y10T428/31678 , Y10T428/31721
摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one embodiment a kit for carrying out the binding of metals to a substrate is provided, comprising: a container comprising a heat-resistant organic molecule derivatized with an attachment group Y and a binding group X, the binding group X promotes binding of metals; and instructional materials teaching coupling the organic molecule to the substrate by heating the molecule and/or the surface to a temperature of at least 25° C.
摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个实施方案中，提供了一种用于进行金属与基底结合的试剂盒，其包含：包含用附着基团Y和结合基团X衍生的耐热有机分子的容器，所述结合基团X促进金属的结合; 以及通过将分子和/或表面加热至至少25℃的温度将有机分子耦合到基底上的教学材料。
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4.发明授权公开(公告)号：US08323769B2
公开(公告)日：2012-12-04
申请号：US12628978
申请日：2009-12-01
申请人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
发明人： Werner G. Kuhr , Steven Z. Shi , Jen-Chieh Wei , Zhiming Liu , Lingyun Wei
CPC分类号： H05K3/389 , C23C18/1653 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/40 , H05K3/181 , H05K3/182 , H05K2203/1105 , H05K2203/121 , Y10T428/24322 , Y10T428/31511 , Y10T428/31678 , Y10T428/31721
摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.
摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。
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公开(公告)号：US09763336B2
公开(公告)日：2017-09-12
申请号：US14009517
申请日：2010-07-06
申请人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
发明人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
IPC分类号： C23C8/12 , C23C22/63 , H05K3/38 , C23C8/16 , C23C22/83 , C09J5/02 , C08J5/12 , C23C8/40 , C23C8/80 , H05K3/46
CPC分类号： H05K3/385 , C08J5/12 , C08J2363/00 , C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/20 , C23C8/12 , C23C8/16 , C23C8/40 , C23C8/80 , C23C22/63 , C23C22/83 , H05K3/389 , H05K3/4673 , H05K2203/0315 , H05K2203/065 , H05K2203/1157
摘要： Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.
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6.发明授权Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards 有权处理铜表面以增强对用于印刷电路板的有机基板的粘附性的方法公开(公告)号：US09345149B2
公开(公告)日：2016-05-17
申请号：US13142588
申请日：2010-07-06
申请人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
发明人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
CPC分类号： H05K3/385 , H05K1/09 , H05K3/389 , H05K3/4652 , H05K2203/1157 , Y10T156/10
摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.
摘要翻译： 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。
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7.发明申请Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards 有权处理铜表面以增强与印刷电路板中使用有机基板的粘附性的方法公开(公告)号：US20120125514A1
公开(公告)日：2012-05-24
申请号：US13142588
申请日：2010-07-06
申请人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
发明人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
CPC分类号： H05K3/385 , H05K1/09 , H05K3/389 , H05K3/4652 , H05K2203/1157 , Y10T156/10
摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.
摘要翻译： 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。
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公开(公告)号：US20140261897A1
公开(公告)日：2014-09-18
申请号：US14009517
申请日：2010-07-06
申请人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
发明人： Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
CPC分类号： H05K3/385 , C08J5/12 , C08J2363/00 , C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/20 , C23C8/12 , C23C8/16 , C23C8/40 , C23C8/80 , C23C22/63 , C23C22/83 , H05K3/389 , H05K3/4673 , H05K2203/0315 , H05K2203/065 , H05K2203/1157
摘要： Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.
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9.发明申请公开(公告)号：US20100071938A1
公开(公告)日：2010-03-25
申请号：US12628978
申请日：2009-12-01
申请人： Werner G. Kuhr , Steven Z. Shi , Jen-Chich Wei , Zhiming Liu , Lingyun Wei
发明人： Werner G. Kuhr , Steven Z. Shi , Jen-Chich Wei , Zhiming Liu , Lingyun Wei
CPC分类号： H05K3/389 , C23C18/1653 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/40 , H05K3/181 , H05K3/182 , H05K2203/1105 , H05K2203/121 , Y10T428/24322 , Y10T428/31511 , Y10T428/31678 , Y10T428/31721
摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.
摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。
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10.发明授权Multipodal tethers for high-density attachment of redox-active moieties to substrates 有权用于将氧化还原活性部分高密度连接到底物的多峰系链公开(公告)号：US08173630B2
公开(公告)日：2012-05-08
申请号：US11446586
申请日：2006-06-01
申请人： Jonathan S. Lindsey , David F. Bocian , Robert Loewe , Ignacio Sanchez , Werner G. Kuhr , Kisari Padmaja , Lingyun Wei
发明人： Jonathan S. Lindsey , David F. Bocian , Robert Loewe , Ignacio Sanchez , Werner G. Kuhr , Kisari Padmaja , Lingyun Wei
IPC分类号： A01N55/02 , C07B47/00 , C07D487/22
CPC分类号： C07D207/335 , B82Y10/00 , B82Y30/00 , C07C17/093 , C07C21/17 , C07C25/24 , C07C45/44 , C07C45/58 , C07C47/548 , C07C255/50 , H01L51/0077 , H01L51/0595 , C07C47/24 , C07C25/22
摘要： This invention provides redox-active molecules attached to polypodal (e.g., bipodal, tripodal, quadrapodal, pentapodal, etc.) tethers that can be used for attachment of the redox-active molecules to a substrate (e.g., an electrode). The tethered redox-active molecules are useful for the fabrication of memory devices.
摘要翻译： 本发明提供连接到可以用于将氧化还原活性分子连接到底物（例如电极）上的多峰（例如，双峰，三峰，四峰，五峰等）系链的氧化还原活性分子。 系留的氧化还原活性分子可用于制造存储器件。
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