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    Methods of Treating a Surface to Promote Metal Plating and Devices Formed
    2.
    发明申请
    Methods of Treating a Surface to Promote Metal Plating and Devices Formed 审中-公开
    处理表面促进金属电镀和器件形成的方法

    公开(公告)号：US20090056994A1

    公开(公告)日：2009-03-05

    申请号：US11848860

    申请日：2007-08-31

    申请人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

    发明人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

    IPC分类号： H05K1/02 ,  B05C9/14 ,  B05D3/10

    CPC分类号： H05K3/389 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/40 ,  H05K3/181 ,  H05K3/182 ,  H05K2203/1105 ,  H05K2203/121 ,  Y10T428/24322 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

    摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

    摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。

    Methods of treating a surface to promote metal plating and devices formed
    3.
    发明授权
    Methods of treating a surface to promote metal plating and devices formed 有权
    处理表面以促进金属电镀和形成的器件的方法

    公开(公告)号：US08323769B2

    公开(公告)日：2012-12-04

    申请号：US12628978

    申请日：2009-12-01

    申请人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

    发明人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

    IPC分类号： B32B3/10 ,  B32B15/04 ,  B32B15/08

    CPC分类号： H05K3/389 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/40 ,  H05K3/181 ,  H05K3/182 ,  H05K2203/1105 ,  H05K2203/121 ,  Y10T428/24322 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

    摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

    摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。

    Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
    6.
    发明授权
    Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards 有权
    处理铜表面以增强对用于印刷电路板的有机基板的粘附性的方法

    公开(公告)号：US09345149B2

    公开(公告)日：2016-05-17

    申请号：US13142588

    申请日：2010-07-06

    申请人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

    发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

    IPC分类号： B32B38/08 ,  B05D5/12 ,  B32B37/14 ,  B05D3/10 ,  H05K3/38 ,  H05K3/46

    CPC分类号： H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

    摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

    摘要翻译： 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。

    Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards
    7.
    发明申请
    Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards 有权
    处理铜表面以增强与印刷电路板中使用有机基板的粘附性的方法

    公开(公告)号：US20120125514A1

    公开(公告)日：2012-05-24

    申请号：US13142588

    申请日：2010-07-06

    申请人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

    发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

    IPC分类号： B32B38/08 ,  B05D5/12 ,  B32B37/14 ,  B05D3/10

    CPC分类号： H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

    摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

    摘要翻译： 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。