发明申请
- 专利标题： LED Structure, Manufacturing Method Thereof and LED Module
- 专利标题（中）： LED结构及其制造方法和LED模块
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申请号： US12566943申请日： 2009-09-25
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公开(公告)号： US20100084958A1公开(公告)日： 2010-04-08
- 发明人: Chih-Tsung Shih , Chen-Peng Hsu , Hung-Lieh Hu
- 申请人： Chih-Tsung Shih , Chen-Peng Hsu , Hung-Lieh Hu
- 申请人地址： TW Hsinchu
- 专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01J7/24
- IPC分类号： H01J7/24 ; H01L33/00
摘要：
A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED.
公开/授权文献
- US08304785B2 LED structure, manufacturing method thereof and LED module 公开/授权日：2012-11-06
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