发明申请
US20100090303A1 SOI SUBSTRATE AND METHOD FOR PRODUCING THE SAME, SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR PRODUCING THE SAME, AND IMAGE PICKUP APPARATUS 失效
SOI基板及其制造方法,固态图像拾取装置及其制造方法以及图像拾取装置

  • 专利标题: SOI SUBSTRATE AND METHOD FOR PRODUCING THE SAME, SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR PRODUCING THE SAME, AND IMAGE PICKUP APPARATUS
  • 专利标题(中): SOI基板及其制造方法,固态图像拾取装置及其制造方法以及图像拾取装置
  • 申请号: US12574016
    申请日: 2009-10-06
  • 公开(公告)号: US20100090303A1
    公开(公告)日: 2010-04-15
  • 发明人: Ritsuo Takizawa
  • 申请人: Ritsuo Takizawa
  • 申请人地址: JP Tokyo
  • 专利权人: SONY CORPORATION
  • 当前专利权人: SONY CORPORATION
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2008-263559 20081010; JP2009-062397 20090316
  • 主分类号: H01L31/0232
  • IPC分类号: H01L31/0232 H01L29/30 H01L21/322 H01L21/762 H01L31/18
SOI SUBSTRATE AND METHOD FOR PRODUCING THE SAME, SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR PRODUCING THE SAME, AND IMAGE PICKUP APPARATUS
摘要:
A SOI substrate includes a silicon substrate, a silicon oxide layer arranged on the silicon substrate, a silicon layer arranged on the silicon oxide layer, a gettering layer arranged in the silicon substrate, and a damaged layer formed of an impurity-doped region arranged in the silicon oxide layer.
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