发明申请
US20100095865A1 PRECURSOR COMPOSITIONS FOR ALD/CVD OF GROUP II RUTHENATE THIN FILMS
有权
用于II组RUTHENATE薄膜的ALD / CVD的前体组合物
- 专利标题: PRECURSOR COMPOSITIONS FOR ALD/CVD OF GROUP II RUTHENATE THIN FILMS
- 专利标题(中): 用于II组RUTHENATE薄膜的ALD / CVD的前体组合物
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申请号: US12523704申请日: 2007-03-12
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公开(公告)号: US20100095865A1公开(公告)日: 2010-04-22
- 发明人: Chongying Xu , Bryan C. Hendrix , Thomas M. Cameron , Jeffrey F. Roeder , Matthias Stender , Tianniu Chen
- 申请人: Chongying Xu , Bryan C. Hendrix , Thomas M. Cameron , Jeffrey F. Roeder , Matthias Stender , Tianniu Chen
- 申请人地址: US CT Danbury
- 专利权人: ADVANCED TECHNOLOGY MATERIALS, INC.
- 当前专利权人: ADVANCED TECHNOLOGY MATERIALS, INC.
- 当前专利权人地址: US CT Danbury
- 国际申请: PCT/US2007/063831 WO 20070312
- 主分类号: C23C16/18
- IPC分类号: C23C16/18 ; C23C16/30
摘要:
Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO3) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.
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