发明申请
- 专利标题： Input/output package architectures, and methods of using same
- 专利标题（中）： 输入/输出包体系结构及其使用方法
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申请号： US12587175申请日： 2009-10-01
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公开(公告)号： US20100096743A1公开(公告)日： 2010-04-22
- 发明人: Sanka Ganesan , Kemal Aygun , Chandrashekhar Ramaswamy , Eric Palmer , Henning Braunisch
- 申请人： Sanka Ganesan , Kemal Aygun , Chandrashekhar Ramaswamy , Eric Palmer , Henning Braunisch
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L23/48
摘要：
A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s.
公开/授权文献
- US08188594B2 Input/output package architectures 公开/授权日：2012-05-29
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