发明申请
- 专利标题： Double Solid Metal Pad with Reduced Area
- 专利标题（中）： 双面实心金属垫，减少面积
-
申请号： US12272501申请日： 2008-11-17
-
公开(公告)号： US20100123246A1公开(公告)日： 2010-05-20
- 发明人: Hsien-Wei Chen , Yu-Wen Liu , Hao-Yi Tsai , Shin-Puu Jeng , Ying-Ju Chen
- 申请人： Hsien-Wei Chen , Yu-Wen Liu , Hao-Yi Tsai , Shin-Puu Jeng , Ying-Ju Chen
- 主分类号： H01L23/488
- IPC分类号： H01L23/488
摘要：
An integrated circuit structure includes a bond pad; an Mtop pad located directly underlying the bond pad; an Mtop-1 pad having at least a portion directly underlying the Mtop pad, wherein at least one of the Mtop pad and the Mtop-1 pad has a horizontal dimension smaller than a horizontal dimension of the bond pad; a plurality of vias interconnecting the Mtop pad and the Mtop-1 pad; and a bond ball on the bond pad. Each of the Mtop pad and the Mtop-1 pad has positive enclosures to the bond ball in all horizontal directions.
公开/授权文献
- US08581423B2 Double solid metal pad with reduced area 公开/授权日：2013-11-12