Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US12631109Application Date: 2009-12-04
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Publication No.: US20100140720A1Publication Date: 2010-06-10
- Inventor: Dongyean Oh , Woon-kyung Lee
- Applicant: Dongyean Oh , Woon-kyung Lee
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2008-0122600 20081204
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness less than the first thickness. At least one of the transistors formed on the first or second gate insulating layers is directly over a dummy well.
Public/Granted literature
- US08237230B2 Semiconductor device comprising a dummy well and method of fabricating the same Public/Granted day:2012-08-07
Information query
IPC分类: