发明申请
US20100143579A1 METHOD AND APPARATUS FOR MANUFACTURING EPITAXIAL SILICON WAFER 有权
用于制造外延硅片的方法和装置

  • 专利标题: METHOD AND APPARATUS FOR MANUFACTURING EPITAXIAL SILICON WAFER
  • 专利标题(中): 用于制造外延硅片的方法和装置
  • 申请号: US12632032
    申请日: 2009-12-07
  • 公开(公告)号: US20100143579A1
    公开(公告)日: 2010-06-10
  • 发明人: Kazuhiro NARAHARA
  • 申请人: Kazuhiro NARAHARA
  • 申请人地址: JP Nagasaki
  • 专利权人: SUMCO TECHXIV CORPORATION
  • 当前专利权人: SUMCO TECHXIV CORPORATION
  • 当前专利权人地址: JP Nagasaki
  • 优先权: JP2008-315108 20081210; JP2008-315109 20081210
  • 主分类号: C23C16/52
  • IPC分类号: C23C16/52 C23C16/00
METHOD AND APPARATUS FOR MANUFACTURING EPITAXIAL SILICON WAFER
摘要:
A method of manufacturing an epitaxial wafer in which an epitaxial layer is grown over a main surface of a silicon wafer placed substantially horizontally on a susceptor is provided. The method comprises: a growing step of the epitaxial layer; and a cooling step of cooling the epitaxial wafer having the epitaxial layer. The cooling step comprises: a wafer measurement step of measuring a temperature of the epitaxial wafer; a susceptor measurement step of measuring a temperature of the susceptor; and a control step of controlling a heater capable of heating at least the susceptor or the epitaxial wafer such that difference between a temperature of the epitaxial wafer and a temperature of the susceptor is within a predetermined range.
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