发明申请
- 专利标题： FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
- 专利标题（中）： FLIP芯片安装过程和FLIP芯片组件
-
申请号： US12717433申请日： 2010-03-04
-
公开(公告)号： US20100148376A1公开(公告)日： 2010-06-17
- 发明人: Seiji Karashima , Yoshihisa Yamashita , Satoru Tomekawa , Takashi Kitae , Seiichi Nakatani
- 申请人： Seiji Karashima , Yoshihisa Yamashita , Satoru Tomekawa , Takashi Kitae , Seiichi Nakatani
- 优先权： JP2004-267919 20040915; JP2005-091347 20050328
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60
摘要：
A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).
公开/授权文献
- US08012801B2 Flip chip mounting process and flip chip assembly 公开/授权日：2011-09-06
信息查询
IPC分类:
