发明申请
- 专利标题: Method for manufacturing semiconductor laser
- 专利标题(中): 制造半导体激光器的方法
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申请号: US12591286申请日: 2009-11-16
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公开(公告)号: US20100151611A1公开(公告)日: 2010-06-17
- 发明人: Tsuyoshi Fujimoto , Nozomi Ohashi , Masaru Kuramoto , Eiji Nakayama
- 申请人: Tsuyoshi Fujimoto , Nozomi Ohashi , Masaru Kuramoto , Eiji Nakayama
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-318052 20081215
- 主分类号: H01L21/28
- IPC分类号: H01L21/28
摘要:
A method for manufacturing a semiconductor laser includes the steps of forming a mask layer having a stripe-shaped mask portion corresponding to a ridge stripe to be formed on a nitride-based group III-V compound semiconductor layer, etching the nitride-based group III-V compound semiconductor layer to a predetermined depth using the mask layer to form the ridge stripe, forming a resist to cover the mask layer and the nitride-based group III-V compound semiconductor layer, etching-back the resist until the stripe-shaped mask portion of the mask layer is exposed, removing the exposed mask portion of the mask layer by etching to expose the upper surface of the ridge stripe, forming a metal film on the resist and the exposed ridge stripe to form an electrode on the ridge stripe, removing the resist together with the metal film formed thereon, and removing the mask layer by etching.
公开/授权文献
- US07943407B2 Method for manufacturing semiconductor laser 公开/授权日:2011-05-17
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